MAX4685EBC-T

MAX4685EBC-T

Manufacturer No:

MAX4685EBC-T

Description:

IC SW SPDT-NO/NCX2 800MOHM 10CSP

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

MAX4685EBC-T Specifications

  • Type
    Parameter
  • Supplier Device Package
    10-UCSP
  • Package / Case
    10-WFBGA, CSPBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -68dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    1nA
  • Channel Capacitance (CS(off), CD(off))
    84pF
  • Charge Injection
    200pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    50ns, 30ns
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    1.8V ~ 5.5V
  • Channel-to-Channel Matching (ΔRon)
    60mOhm (Max)
  • On-State Resistance (Max)
    800mOhm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    SPDT - NO/NC
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The XCZU1EG-1SFVC784E is a specific model of the Xilinx Zynq UltraScale+ MPSoC (Multiprocessor System-on-Chip) family. It offers a combination of processing system (PS) and programmable logic (PL) in a single chip, providing several advantages and application scenarios:Advantages: 1. High-performance processing: The XCZU1EG-1SFVC784E integrates ARM Cortex-A53 and Cortex-R5 processors, enabling high-performance processing capabilities for various applications. 2. Programmable logic: The programmable logic fabric allows for customization and acceleration of specific functions, making it suitable for a wide range of applications. 3. Heterogeneous processing: The combination of processing system and programmable logic enables the XCZU1EG-1SFVC784E to handle both real-time processing and high-performance computing tasks efficiently. 4. Low power consumption: The chip is designed to optimize power consumption, making it suitable for power-constrained applications. 5. High-speed interfaces: The XCZU1EG-1SFVC784E supports various high-speed interfaces like PCIe, Ethernet, USB, and DDR4, enabling connectivity with external devices and systems.Application scenarios: 1. Embedded systems: The XCZU1EG-1SFVC784E is commonly used in embedded systems that require high-performance processing, real-time capabilities, and customization options. It can be found in applications like industrial automation, robotics, and automotive systems. 2. Edge computing: With its heterogeneous processing capabilities, the chip is suitable for edge computing applications where real-time processing and AI/ML acceleration are required. It can be used in edge devices for video analytics, IoT gateways, and smart surveillance systems. 3. Wireless communication: The XCZU1EG-1SFVC784E can be utilized in wireless communication systems, such as base stations and software-defined radios (SDR), where it can handle signal processing tasks efficiently. 4. Data centers: The chip's high-performance processing and programmable logic make it suitable for data center applications, including network acceleration, storage systems, and virtualization. 5. Aerospace and defense: The XCZU1EG-1SFVC784E can be used in aerospace and defense applications, such as radar systems, avionics, and secure communication systems, where high-performance processing and customization options are crucial.It's important to note that the specific use cases and applications may vary depending on the system requirements and the expertise of the designers.