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HI3-0307-5

HI3-0307-5

Manufacturer No:

HI3-0307-5

Manufacturer:

Harris Corporation

Description:

IC SWITCH SPDT X 2 50OHM 14DIP

Datasheet:

Datasheet

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Payment:

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HI3-0307-5 Specifications

  • Type
    Parameter
  • Supplier Device Package
    14-PDIP
  • Package / Case
    14-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    -55°C ~ 125°C
  • Crosstalk
    -40dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    1nA
  • Channel Capacitance (CS(off), CD(off))
    28pF
  • Charge Injection
    -
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    250ns, 150ns
  • Voltage - Supply, Dual (V±)
    ±15V
  • Voltage - Supply, Single (V+)
    4V ~ 15V
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    50Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    1:2
  • Switch Circuit
    SPDT
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The M2S090TS-FGG676I integrated circuit chip is a specific model in the M2S series of Field Programmable Gate Array (FPGA) chips developed by Microchip Technology. Here are some advantages and application scenarios of the M2S090TS-FGG676I integrated circuit chip:Advantages: 1. High Performance: The M2S090TS-FGG676I chip offers high computing power and performance. It provides a large number of programmable logic cells, dedicated DSP (Digital Signal Processing) blocks, and high-speed I/O interfaces. 2. Flexibility: It is a programmable chip, which means that its functionality can be configured and reconfigured according to the specific application requirements. This flexibility allows it to adapt to a wide range of applications. 3. Reduced Time-to-Market: With the ability to reprogram the chip, developers can significantly reduce the time required for design iterations and prototyping, thereby accelerating the time-to-market for their products. 4. Cost-Effective: FPGA chips like the M2S090TS-FGG676I can often replace multiple dedicated chips, reducing the component count and overall system cost. 5. Power Efficiency: The M2S090TS-FGG676I chip is designed to deliver high performance while minimizing power consumption, making it suitable for power-constrained applications.Application Scenarios: 1. Industrial Automation: The M2S090TS-FGG676I chip can be used in industrial automation systems, where it can perform various functions such as process control, motor control, and data acquisition with high efficiency and real-time responsiveness. 2. Communications and Networking: It is suitable for implementing high-speed data interfaces and protocols required in communication systems, such as Ethernet, USB, and Serial RapidIO. 3. Aerospace and Defense: The M2S090TS-FGG676I chip's high performance and flexibility make it valuable in aerospace and defense applications, including radar systems, electronic warfare, and avionics. 4. Image and Video Processing: It can be utilized in image and video processing systems, enabling algorithms like image recognition, object tracking, and video compression to be implemented efficiently. 5. Internet of Things (IoT): The M2S090TS-FGG676I chip can be used to build IoT devices and gateways that require advanced data processing, connectivity, and real-time capabilities.It is important to note that the specific advantages and application scenarios may vary depending on the requirements and characteristics of the target system. Additionally, it's recommended to consult the official documentation and technical specifications provided by Microchip Technology for accurate and detailed information about the M2S090TS-FGG676I integrated circuit chip.
HI3-0307-5 Relevant information