DG401DVZ

DG401DVZ

Manufacturer No:

DG401DVZ

Manufacturer:

Intersil

Description:

IC SW SPST-NOX2 45OHM 16TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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DG401DVZ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TSSOP
  • Package / Case
    16-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -90dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    500pA
  • Channel Capacitance (CS(off), CD(off))
    12pF, 12pF
  • Charge Injection
    60pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    150ns, 100ns
  • Voltage - Supply, Dual (V±)
    ±5V ~ 17V
  • Voltage - Supply, Single (V+)
    5V ~ 34V
  • Channel-to-Channel Matching (ΔRon)
    3Ohm
  • On-State Resistance (Max)
    45Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The M2S025TS-1FGG484M is an integrated circuit chip from Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S025TS-1FGG484M chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 processor core. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, processor, memory, and peripherals, into a single device. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features like secure boot, tamper detection, and secure key storage. This makes the M2S025TS-1FGG484M chip suitable for applications that require robust security measures. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 processor core provide high-performance computing capabilities, enabling complex algorithms and real-time processing.Application scenarios: 1. Industrial automation: The M2S025TS-1FGG484M chip can be used in industrial automation systems for tasks like motor control, sensor interfacing, and communication protocols. The FPGA fabric allows for customization of I/O interfaces and real-time processing, while the processor core handles higher-level control tasks. 2. Internet of Things (IoT): With its combination of FPGA and processor, the chip can be used in IoT devices that require both hardware acceleration and software programmability. It can handle tasks like data processing, encryption, and communication protocols. 3. Aerospace and defense: The chip's security features make it suitable for aerospace and defense applications that require protection against tampering or unauthorized access. It can be used in avionics systems, secure communication devices, or military-grade equipment. 4. Medical devices: The M2S025TS-1FGG484M chip can be utilized in medical devices that require real-time processing, sensor interfacing, and secure data handling. It can be used in applications like patient monitoring systems, medical imaging, or diagnostic equipment. 5. Communications: The chip's FPGA fabric can be used for implementing custom communication protocols or signal processing algorithms. It can be used in applications like network routers, software-defined radios, or high-speed data acquisition systems.These are just a few examples of the advantages and application scenarios of the M2S025TS-1FGG484M chip. The versatility and integration of this chip make it suitable for a wide range of applications where both hardware customization and software programmability are required.