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HI3-0201-5

HI3-0201-5

Manufacturer No:

HI3-0201-5

Manufacturer:

Intersil

Description:

IC SWITCH SPST-NCX4 80OHM 16DIP

Datasheet:

Datasheet

Delivery:

Payment:

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HI3-0201-5 Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-PDIP
  • Package / Case
    16-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Crosstalk
    -90dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    10nA
  • Channel Capacitance (CS(off), CD(off))
    5pF, 5pF
  • Charge Injection
    20pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    500ns, 350ns
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 18V
  • Voltage - Supply, Single (V+)
    5V ~ 30V
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    80Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NC
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The OR3TP127BA352-DB is a specific model of integrated circuit (IC) chip manufactured by Lattice Semiconductor. While specific application scenarios may vary, here are some general advantages and potential use cases for this chip:Advantages: 1. FPGA Functionality: The OR3TP127BA352-DB is based on a Field-Programmable Gate Array (FPGA) architecture, offering reconfigurable logic elements. This allows users to program the chip's functionality according to their specific needs, providing flexibility and adaptability. 2. High Performance: The OR3TP127BA352-DB offers high-performance capabilities, including high logic density and fast processing speeds, enabling it to handle complex tasks and computations efficiently. 3. Low Power Consumption: The chip is designed to be power-efficient, which is essential for many applications where energy consumption is a concern. 4. System Integration: It offers various integrated features such as configurable I/O pins, on-chip memory blocks, and input buffers. These capabilities facilitate seamless integration with other system components and peripherals.Application Scenarios: 1. Communications and Networking: The FPGA functionality of the OR3TP127BA352-DB makes it suitable for applications in telecommunications, networking, and data communication systems. It can be utilized for protocol conversions, networking protocols, signal processing, and packet processing tasks. 2. Industrial Automation and Control: With its high-performance capabilities, the chip can be used in industrial control systems, automation equipment, and robotics. It can handle real-time control algorithms, sensor interfacing, and various data processing tasks. 3. Video and Image Processing: The OR3TP127BA352-DB can be employed in applications involving video and image processing, such as video encoding/decoding, image recognition, and computer vision tasks. 4. IoT and Embedded Systems: Due to its low power consumption and system integration features, the chip is well-suited for Internet of Things (IoT) devices, edge computing systems, and embedded applications. It can facilitate sensor data aggregation, data preprocessing, and integration with IoT platforms. 5. Automotive Electronics: The OR3TP127BA352-DB can find application in automotive electronics, including advanced driver-assistance systems (ADAS). It can handle tasks like sensor fusion, real-time data processing, and control algorithms for intelligent automotive features.These are general advantages and potential application scenarios, but the specific use cases and suitability may vary based on project requirements and individual needs.
HI3-0201-5 Relevant information