ISL5123CBZ

ISL5123CBZ

Manufacturer No:

ISL5123CBZ

Manufacturer:

Intersil

Description:

IC SWITCH SPDT X 1 20OHM 8SOIC

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

ISL5123CBZ Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -105dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    100pA
  • Channel Capacitance (CS(off), CD(off))
    8pF, 8pF
  • Charge Injection
    5pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    35ns, 30ns
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    2.7V ~ 12V
  • Channel-to-Channel Matching (ΔRon)
    800mOhm
  • On-State Resistance (Max)
    20Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    SPDT
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    -
The P1012NXN2DFB is a specific model of integrated circuit chip developed by NXP Semiconductors. It belongs to the PowerQUICC II Pro family of processors and is designed for embedded networking and industrial applications. Here are some advantages and application scenarios of the P1012NXN2DFB:Advantages: 1. High Performance: The P1012NXN2DFB chip is built on Power Architecture technology, offering a high-performance processing core with clock speeds up to 800 MHz. It provides efficient data processing capabilities for demanding applications.2. Integrated Features: This chip integrates various peripherals and interfaces, including Ethernet controllers, USB ports, serial interfaces, and memory controllers. It reduces the need for additional external components, simplifying the overall system design.3. Low Power Consumption: The P1012NXN2DFB chip is designed to be power-efficient, making it suitable for applications where energy consumption is a concern. It helps in reducing overall system power requirements and extending battery life in portable devices.4. Industrial-Grade Reliability: The chip is designed to meet industrial-grade requirements, including extended temperature ranges, high reliability, and long-term availability. It can withstand harsh operating conditions, making it suitable for industrial automation, control systems, and networking equipment.Application Scenarios: 1. Industrial Automation: The P1012NXN2DFB chip can be used in various industrial automation applications, such as programmable logic controllers (PLCs), motor control systems, and industrial communication gateways. Its high performance and reliability make it suitable for real-time control and communication tasks.2. Network Appliances: The chip's integrated Ethernet controllers and high-performance processing capabilities make it suitable for network appliances like routers, switches, and gateways. It can handle data processing, routing, and security tasks efficiently.3. Embedded Networking: The P1012NXN2DFB chip can be used in embedded networking applications, such as networked storage devices, networked printers, and networked surveillance systems. Its integrated features and low power consumption make it suitable for small form-factor devices.4. Internet of Things (IoT): With its power-efficient design and integrated connectivity options, the chip can be used in IoT devices that require networking capabilities. It can enable secure communication, data processing, and control in IoT applications like smart homes, industrial IoT, and smart cities.Overall, the P1012NXN2DFB chip offers a combination of high performance, integrated features, and industrial-grade reliability, making it suitable for a wide range of embedded networking and industrial applications.