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ISL84541IPZ

ISL84541IPZ

Manufacturer No:

ISL84541IPZ

Manufacturer:

Intersil

Description:

IC SWITCH SPST-NO X 2 60OHM 8DIP

Datasheet:

Datasheet

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ISL84541IPZ Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-PDIP
  • Package / Case
    8-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -90dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    100pA
  • Channel Capacitance (CS(off), CD(off))
    8pF, 8pF
  • Charge Injection
    1pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    100ns, 75ns
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    2.7V ~ 12V
  • Channel-to-Channel Matching (ΔRon)
    800mOhm
  • On-State Resistance (Max)
    60Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The XCZU3EG-1SFVA625E is a specific model of the Xilinx Zynq UltraScale+ MPSoC family of integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance processing: The XCZU3EG-1SFVA625E chip combines a quad-core ARM Cortex-A53 processor with a dual-core ARM Cortex-R5 real-time processor, along with programmable logic resources. This allows for high-performance processing capabilities, making it suitable for demanding applications.2. Programmable logic: The chip includes programmable logic resources, which can be used to implement custom hardware accelerators, interfaces, or other specialized functionality. This flexibility enables the chip to be tailored to specific application requirements.3. Integrated peripherals: The XCZU3EG-1SFVA625E chip includes a wide range of integrated peripherals such as USB, Ethernet, PCIe, and DDR memory controllers. This simplifies system design and reduces the need for additional external components.4. Power efficiency: The chip is designed to be power-efficient, making it suitable for applications where power consumption is a concern. It includes power management features that allow for dynamic power scaling and optimization.Application scenarios: 1. Embedded systems: The XCZU3EG-1SFVA625E chip is commonly used in embedded systems where a combination of high-performance processing and programmable logic is required. It can be used in applications such as industrial automation, robotics, and automotive systems.2. Edge computing: With its powerful processing capabilities, the chip is well-suited for edge computing applications. It can perform real-time data processing and analysis at the edge of the network, reducing latency and improving overall system performance.3. High-bandwidth data processing: The XCZU3EG-1SFVA625E chip's integrated peripherals, such as PCIe and DDR memory controllers, make it suitable for applications that require high-bandwidth data processing. This includes areas like high-speed networking, data centers, and video processing.4. Software-defined systems: The chip's combination of processing cores and programmable logic makes it ideal for implementing software-defined systems. It can be used to create flexible and reconfigurable hardware platforms that can adapt to changing requirements.Overall, the XCZU3EG-1SFVA625E chip offers a balance of processing power, flexibility, and power efficiency, making it suitable for a wide range of applications that require high-performance processing and programmable logic capabilities.
ISL84541IPZ Relevant information