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NX3L1G3157GW

NX3L1G3157GW

Manufacturer No:

NX3L1G3157GW

Manufacturer:

NXP USA Inc.

Description:

SPDT 1 FUNC 1 CHANNEL

Datasheet:

Datasheet

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Payment:

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NX3L1G3157GW Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Package / Case
    -
  • Mounting Type
    -
  • Operating Temperature
    -
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    -
  • Channel Capacitance (CS(off), CD(off))
    -
  • Charge Injection
    -
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    -
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    -
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    -
  • Multiplexer/Demultiplexer Circuit
    -
  • Switch Circuit
    -
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    *
The M2S090-1FCSG325I is an integrated circuit chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S090-1FCSG325I chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features such as secure boot, tamper detection, and secure key storage. This makes the M2S090-1FCSG325I chip suitable for applications that require robust security measures. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 microcontroller subsystem provide high-performance processing capabilities, enabling complex algorithms and real-time processing.Application scenarios: 1. Industrial automation: The M2S090-1FCSG325I chip can be used in industrial automation applications such as motor control, machine vision, and process control. The FPGA fabric allows for custom hardware interfaces and real-time control, while the microcontroller subsystem can handle communication protocols and higher-level processing. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller, the chip is suitable for IoT applications that require both hardware customization and software flexibility. It can be used in IoT gateways, edge computing devices, or sensor nodes. 3. Aerospace and defense: The M2S090-1FCSG325I chip's security features make it suitable for aerospace and defense applications that require protection against tampering or unauthorized access. It can be used in avionics systems, secure communication devices, or military-grade equipment. 4. Medical devices: The chip's low power consumption and high performance make it suitable for medical devices such as patient monitoring systems, portable diagnostic devices, or implantable devices. 5. Communications: The M2S090-1FCSG325I chip can be used in communication systems that require high-speed data processing, such as network switches, routers, or base stations.These are just a few examples of the advantages and application scenarios of the M2S090-1FCSG325I chip. The versatility and integration of this chip make it suitable for a wide range of applications where both hardware customization and software programmability are required.
NX3L1G3157GW Relevant information