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PCA9544AWP112

PCA9544AWP112

Manufacturer No:

PCA9544AWP112

Manufacturer:

NXP USA Inc.

Description:

IC I2C MUX 4CH 20-TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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PCA9544AWP112 Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Package / Case
    -
  • Mounting Type
    -
  • Operating Temperature
    -
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    -
  • Channel Capacitance (CS(off), CD(off))
    -
  • Charge Injection
    -
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    -
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    -
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    -
  • Multiplexer/Demultiplexer Circuit
    -
  • Switch Circuit
    -
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    *
The XCZU3CG-L2UBVA530E is a specific model of integrated circuit (IC) chip from Xilinx. It belongs to the Xilinx Zynq UltraScale+ MPSoC family and offers several advantages and application scenarios. Here are some key points:Advantages: 1. Versatility: The XCZU3CG-L2UBVA530E is a highly versatile chip that combines a processing system (ARM Cortex-A53) with programmable logic (FPGA) in a single device. This allows for a wide range of applications and flexibility in system design. 2. High-performance processing: The ARM Cortex-A53 processor cores provide high-performance processing capabilities, making it suitable for applications that require significant computational power. 3. Programmable logic: The integrated FPGA fabric allows for hardware acceleration, customization, and real-time processing. It enables the implementation of custom logic and accelerators tailored to specific application requirements. 4. Low power consumption: The XCZU3CG-L2UBVA530E is designed to be power-efficient, making it suitable for applications where power consumption is a concern. 5. Rich peripheral connectivity: The chip offers a wide range of peripheral connectivity options, including high-speed interfaces like PCIe, USB, Ethernet, and DDR4 memory interfaces. This makes it suitable for applications that require connectivity with various external devices.Application scenarios: 1. Embedded systems: The XCZU3CG-L2UBVA530E is commonly used in embedded systems where a combination of high-performance processing and programmable logic is required. It can be used in applications such as industrial automation, robotics, and automotive systems. 2. Edge computing: With its processing power and FPGA fabric, the chip is suitable for edge computing applications. It can perform real-time data processing, machine learning inference, and sensor fusion tasks at the edge of the network. 3. High-performance computing: The XCZU3CG-L2UBVA530E can be used in high-performance computing applications that require parallel processing and hardware acceleration. It can be utilized for tasks like image and signal processing, scientific simulations, and data analytics. 4. Networking and communication: The chip's connectivity options make it suitable for networking and communication applications. It can be used in routers, switches, network interface cards, and software-defined networking (SDN) solutions. 5. Video and image processing: The XCZU3CG-L2UBVA530E's FPGA fabric can be leveraged for video and image processing tasks, such as video encoding/decoding, computer vision, and real-time image analysis.These are just a few examples of the advantages and application scenarios of the XCZU3CG-L2UBVA530E IC chip. The specific use case will depend on the requirements and needs of the system being designed.
PCA9544AWP112 Relevant information