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HI4-0508/883

HI4-0508/883

Manufacturer No:

HI4-0508/883

Manufacturer:

Harris Corporation

Description:

IC MUX 8:1 300OHM 20CLCC

Datasheet:

Datasheet

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HI4-0508/883 Specifications

  • Type
    Parameter
  • Switch Circuit
    -
  • Supplier Device Package
    20-CLCC (8.89x8.89)
  • Package / Case
    20-CLCC
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -55°C ~ 125°C
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    30pA (Typ)
  • Channel Capacitance (CS(off), CD(off))
    10pF, 52pF
  • Charge Injection
    -
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    500ns, 500ns
  • Voltage - Supply, Dual (V±)
    ±15V
  • Voltage - Supply, Single (V+)
    15V
  • Channel-to-Channel Matching (ΔRon)
    15Ohm
  • On-State Resistance (Max)
    300Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The M2S090-FG676I is an integrated circuit chip developed by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of the M2S090-FG676I:Advantages: 1. Versatility: The M2S090-FG676I combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family, including the M2S090-FG676I, offers advanced security features such as secure boot, tamper detection, and secure key storage. These features make it suitable for applications that require robust security measures. 4. Low power consumption: The M2S090-FG676I is designed to be power-efficient, making it suitable for battery-powered or energy-constrained applications. 5. High performance: The FPGA fabric in the chip provides high-speed processing capabilities, enabling the implementation of complex algorithms and high-performance digital signal processing.Application scenarios: 1. Industrial automation: The M2S090-FG676I can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and real-time data processing. The FPGA fabric allows for customization and adaptation to specific industrial requirements. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller subsystem, the chip can be used in IoT devices for edge computing, data aggregation, and protocol conversion. The security features make it suitable for secure IoT applications. 3. Aerospace and defense: The M2S090-FG676I can be used in aerospace and defense applications that require high reliability, security, and performance. It can be used for tasks such as avionics, communication systems, and secure data processing. 4. Medical devices: The chip's low power consumption, security features, and processing capabilities make it suitable for medical devices such as patient monitoring systems, portable diagnostic devices, and medical imaging equipment. 5. Communications: The M2S090-FG676I can be used in communication systems for tasks such as protocol conversion, encryption/decryption, and signal processing. The FPGA fabric allows for customization and adaptation to specific communication standards.These are just a few examples of the advantages and application scenarios of the M2S090-FG676I. The chip's versatility and integration make it suitable for a wide range of applications where a combination of FPGA and microcontroller capabilities is required.
HI4-0508/883 Relevant information