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74HC4052D/AU118

74HC4052D/AU118

Manufacturer No:

74HC4052D/AU118

Manufacturer:

NXP USA Inc.

Description:

DIFFERENTIAL MUX, 4 CHANNEL

Datasheet:

Datasheet

Delivery:

Payment:

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74HC4052D/AU118 Specifications

  • Type
    Parameter
  • Switch Circuit
    -
  • Supplier Device Package
    -
  • Package / Case
    -
  • Mounting Type
    -
  • Operating Temperature
    -
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    -
  • Channel Capacitance (CS(off), CD(off))
    -
  • Charge Injection
    -
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    -
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    -
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    -
  • Multiplexer/Demultiplexer Circuit
    -
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    *
The M2S150T-1FCG1152 is a specific model of integrated circuit (IC) chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of the M2S150T-1FCG1152 IC chip:Advantages: 1. Versatility: The M2S150T-1FCG1152 chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller, memory, and peripherals, onto a single device. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features such as secure boot, tamper detection, and secure key storage. This makes the M2S150T-1FCG1152 chip suitable for applications requiring robust security measures. 4. Low power consumption: The chip is designed to be power-efficient, making it suitable for battery-powered or energy-conscious applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 microcontroller subsystem provide high-performance processing capabilities, enabling complex applications and real-time processing.Application scenarios: 1. Industrial automation: The M2S150T-1FCG1152 chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. Its flexibility allows for customization to specific industrial requirements. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller, the chip can be used in IoT devices for edge computing, data processing, and connectivity. Its security features are also beneficial for securing IoT networks. 3. Aerospace and defense: The M2S150T-1FCG1152 chip's reliability, security features, and high-performance capabilities make it suitable for aerospace and defense applications. It can be used in avionics systems, secure communication devices, or military-grade equipment. 4. Medical devices: The chip's low power consumption, integration, and processing capabilities make it suitable for medical devices such as patient monitoring systems, portable diagnostic equipment, or implantable devices. 5. Communications: The M2S150T-1FCG1152 chip can be used in communication systems, including network routers, switches, or wireless base stations. Its FPGA fabric allows for customization and adaptation to different communication protocols.These are just a few examples of the advantages and application scenarios of the M2S150T-1FCG1152 IC chip. The specific usage depends on the requirements and design considerations of the target application.
74HC4052D/AU118 Relevant information