DG409EY

DG409EY

Manufacturer No:

DG409EY

Manufacturer:

Harris Corporation

Description:

IC SWITCH 4PST X 2 100OHM 16SOIC

Datasheet:

Datasheet

Delivery:

Payment:

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DG409EY Specifications

  • Type
    Parameter
  • Switch Circuit
    -
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    500pA (Typ)
  • Channel Capacitance (CS(off), CD(off))
    3pF, 26pF
  • Charge Injection
    20pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    150ns, 150ns
  • Voltage - Supply, Dual (V±)
    ±15V
  • Voltage - Supply, Single (V+)
    15V
  • Channel-to-Channel Matching (ΔRon)
    15Ohm
  • On-State Resistance (Max)
    100Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    4:1
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The M2S090TS-FG676 integrated circuit chip is a specific model of the Microsemi SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S090TS-FG676 chip combines an FPGA fabric with a hard ARM Cortex-M3 processor core, providing the flexibility of programmable logic and the processing power of a microcontroller in a single chip. 2. Integration: The chip integrates various peripherals, including UART, SPI, I2C, GPIO, timers, and memory controllers, reducing the need for external components and simplifying system design. 3. Security: SmartFusion2 devices offer advanced security features, such as secure boot, tamper detection, and secure key storage, making them suitable for applications that require robust security measures. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High reliability: SmartFusion2 devices are built with reliability features like error correction codes (ECC) and single-event upset (SEU) mitigation, ensuring reliable operation in harsh environments.Application scenarios: 1. Industrial automation: The M2S090TS-FG676 chip can be used in industrial automation systems for tasks like motor control, sensor interfacing, and communication protocols implementation. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller capabilities, the chip is suitable for IoT applications that require both programmable logic and processing power, such as edge computing, sensor fusion, and data preprocessing. 3. Aerospace and defense: The security features and reliability of the chip make it suitable for aerospace and defense applications, including avionics systems, secure communication, and military-grade equipment. 4. Medical devices: The chip's low power consumption, integration of peripherals, and security features make it suitable for medical devices like patient monitoring systems, portable diagnostic tools, and implantable devices. 5. Communications: The chip can be used in communication systems, such as network switches, routers, and gateways, where it can handle data processing, protocol implementation, and interface with various communication standards.These are just a few examples, and the versatility of the M2S090TS-FG676 chip allows it to be used in a wide range of applications that require a combination of programmable logic and microcontroller capabilities.