ISL84053IA

ISL84053IA

Manufacturer No:

ISL84053IA

Manufacturer:

Intersil

Description:

IC SWITCH SPDT X 3 100OHM 16QSOP

Datasheet:

Datasheet

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Payment:

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ISL84053IA Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-QSOP
  • Package / Case
    16-SSOP (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    2pA (Typ)
  • Channel Capacitance (CS(off), CD(off))
    3pF, 9pF
  • Charge Injection
    2pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    50ns, 40ns
  • Voltage - Supply, Dual (V±)
    ±2V ~ 6V
  • Voltage - Supply, Single (V+)
    2V ~ 12V
  • Channel-to-Channel Matching (ΔRon)
    6Ohm (Max)
  • On-State Resistance (Max)
    100Ohm
  • Number of Circuits
    3
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    SPDT
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The XCZU1EG-2SFVC784I is a specific model of the Xilinx Zynq UltraScale+ MPSoC (Multiprocessor System-on-Chip) family. This integrated circuit chip offers several advantages and can be used in various application scenarios. Some of the advantages and application scenarios of the XCZU1EG-2SFVC784I are:Advantages: 1. High Performance: The XCZU1EG-2SFVC784I chip combines the processing power of ARM Cortex-A53 and Cortex-R5 cores with programmable logic, providing high-performance computing capabilities. 2. Programmability: The chip's programmable logic allows for customization and flexibility, enabling developers to implement specific functionalities and algorithms. 3. Heterogeneous Processing: The combination of ARM cores and programmable logic enables the chip to handle both application processing and real-time processing tasks efficiently. 4. Power Efficiency: The XCZU1EG-2SFVC784I chip is designed to optimize power consumption, making it suitable for applications with strict power constraints. 5. Integrated Peripherals: The chip includes various peripherals such as USB, Ethernet, PCIe, and DDR memory controllers, reducing the need for additional external components.Application Scenarios: 1. Embedded Systems: The XCZU1EG-2SFVC784I chip is commonly used in embedded systems that require high-performance processing, real-time capabilities, and flexibility. It can be used in applications like industrial automation, robotics, and automotive systems. 2. Edge Computing: With its heterogeneous processing capabilities, the chip is suitable for edge computing applications where real-time processing and AI inference are required. It can be used in scenarios like video analytics, smart surveillance, and autonomous systems. 3. Software-Defined Radio (SDR): The XCZU1EG-2SFVC784I chip's programmable logic and high-performance processing make it suitable for SDR applications. It can be used to implement various wireless communication standards and protocols. 4. High-Performance Computing (HPC): The chip's processing power and programmability make it suitable for certain HPC applications, such as acceleration of specific algorithms or as a co-processor in a larger HPC system.These are just a few examples of the advantages and application scenarios of the XCZU1EG-2SFVC784I chip. The specific use case and suitability of the chip depend on the requirements and constraints of the target application.