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ISL84781IV

ISL84781IV

Manufacturer No:

ISL84781IV

Manufacturer:

Intersil

Description:

IC MUX 8:1 750MOHM 16TSSOP

Datasheet:

Datasheet

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ISL84781IV Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TSSOP
  • Package / Case
    16-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    4nA
  • Channel Capacitance (CS(off), CD(off))
    65pF, 470pF
  • Charge Injection
    -39pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    25ns, 23ns
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    1.6V ~ 3.6V
  • Channel-to-Channel Matching (ΔRon)
    120mOhm
  • On-State Resistance (Max)
    750mOhm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The M2S150S-1FC1152I is a specific model of integrated circuit (IC) chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this IC chip:Advantages: 1. Versatility: The M2S150S-1FC1152I chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 processor core, providing the flexibility of programmable logic and the processing power of an embedded microcontroller. 2. Integration: It integrates various components, including FPGA fabric, processor, memory, and peripherals, into a single chip. This reduces the need for external components and simplifies the overall system design. 3. Security: The SmartFusion2 family incorporates security features such as secure boot, tamper detection, and secure key storage, making it suitable for applications requiring robust security measures. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High performance: The combination of FPGA fabric and ARM Cortex-M3 processor allows for high-performance computing and real-time processing capabilities.Application scenarios: 1. Industrial automation: The M2S150S-1FC1152I chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. The FPGA fabric can be programmed to implement custom logic for specific industrial applications. 2. Internet of Things (IoT): With its low power consumption and integrated processing capabilities, the chip is suitable for IoT devices that require both programmable logic and microcontroller functionality. It can be used in applications such as smart home automation, environmental monitoring, or asset tracking. 3. Aerospace and defense: The security features of the SmartFusion2 family make it suitable for aerospace and defense applications that require protection against tampering or unauthorized access. It can be used in avionics systems, secure communication devices, or military-grade equipment. 4. Medical devices: The chip's integration and low power consumption make it suitable for medical devices such as patient monitoring systems, portable diagnostic equipment, or implantable devices. 5. Communications: The FPGA fabric can be used to implement custom communication protocols or signal processing algorithms, making the chip suitable for applications in telecommunications, networking, or software-defined radio.These are just a few examples of the advantages and application scenarios of the M2S150S-1FC1152I chip. The specific usage will depend on the requirements and design considerations of the target application.
ISL84781IV Relevant information