ISL84781IR

ISL84781IR

Manufacturer No:

ISL84781IR

Manufacturer:

Intersil

Description:

IC MUX 8:1 750MOHM 16TQFN

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

ISL84781IR Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TQFN (3x3)
  • Package / Case
    16-WFQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    4nA
  • Channel Capacitance (CS(off), CD(off))
    65pF, 470pF
  • Charge Injection
    -39pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    25ns, 23ns
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    1.6V ~ 3.6V
  • Channel-to-Channel Matching (ΔRon)
    120mOhm
  • On-State Resistance (Max)
    750mOhm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The M2S090-FGG484 integrated circuit chip is a specific model of the Microsemi SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S090-FGG484 chip combines an FPGA fabric with a hard ARM Cortex-M3 processor core, providing the flexibility of programmable logic along with the processing power of a microcontroller. 2. Integration: It integrates various components like FPGA fabric, processor, memory, and peripherals into a single chip, reducing the need for external components and simplifying system design. 3. Security: The SmartFusion2 family includes security features like secure boot, secure key storage, and tamper detection, making it suitable for applications requiring high levels of security. 4. Low power consumption: The chip is designed to be power-efficient, making it suitable for battery-powered or energy-conscious applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 processor combination allows for high-performance computing and real-time processing.Application scenarios: 1. Industrial automation: The M2S090-FGG484 chip can be used in industrial automation systems for tasks like motor control, sensor interfacing, and communication protocols. The FPGA fabric can be programmed to implement custom logic for specific industrial applications. 2. Internet of Things (IoT): With its low power consumption and integration capabilities, the chip can be used in IoT devices for edge computing, data processing, and connectivity. 3. Aerospace and defense: The security features of the chip make it suitable for aerospace and defense applications, such as secure communication systems, avionics, and military-grade equipment. 4. Medical devices: The chip can be used in medical devices like patient monitoring systems, medical imaging equipment, and diagnostic devices, where a combination of processing power and programmable logic is required. 5. Communications: The chip can be used in communication systems, such as routers, switches, and network appliances, where high-performance processing and programmable logic are needed for data handling and protocol implementation.These are just a few examples, and the M2S090-FGG484 chip can be applied in various other domains where a combination of FPGA fabric and processor capabilities is advantageous.