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ISL43141IV-T Specifications
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TypeParameter
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Supplier Device Package16-TSSOP
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Package / Case16-TSSOP (0.173", 4.40mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C (TA)
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Crosstalk-90dB @ 100kHz
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Current - Leakage (IS(off)) (Max)1nA
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Channel Capacitance (CS(off), CD(off))7pF, 7pF
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Charge Injection1pC
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-3db Bandwidth-
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Switch Time (Ton, Toff) (Max)80ns, 30ns
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Voltage - Supply, Dual (V±)±2.6V ~ 6V
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Voltage - Supply, Single (V+)2.7V ~ 12V
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Channel-to-Channel Matching (ΔRon)2Ohm
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On-State Resistance (Max)65Ohm
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Number of Circuits4
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Multiplexer/Demultiplexer Circuit1:1
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Switch CircuitSPST - NO
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PackagingBulk
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Product StatusObsolete
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Series-
The M2S090T-FG676I is an integrated circuit chip from Microsemi, which belongs to their SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S090T-FG676I chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family emphasizes security features, including secure boot, tamper detection, and data encryption. This makes the M2S090T-FG676I chip suitable for applications that require robust security measures. 4. Low power consumption: The chip is designed to be power-efficient, making it suitable for battery-powered or energy-conscious applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 microcontroller subsystem provide high-performance processing capabilities, enabling complex applications and real-time processing.Application scenarios: 1. Industrial automation: The M2S090T-FG676I chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. The FPGA fabric allows for customization and adaptation to specific industrial requirements. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller, the chip can be used in IoT devices for edge computing, data processing, and connectivity. The security features make it suitable for secure IoT applications. 3. Aerospace and defense: The chip's security features, high performance, and low power consumption make it suitable for aerospace and defense applications. It can be used in avionics systems, secure communication systems, or military-grade embedded systems. 4. Medical devices: The chip's versatility and security features make it suitable for medical devices that require customization, real-time processing, and data security. 5. Communications: The chip can be used in communication systems, such as routers, switches, or network appliances, where the FPGA fabric can be utilized for protocol handling, data processing, or encryption.These are just a few examples, and the M2S090T-FG676I chip can be applied in various other domains where a combination of FPGA and microcontroller capabilities is required.
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