DG407DY

DG407DY

Manufacturer No:

DG407DY

Manufacturer:

Intersil

Description:

IC MUX DUAL 8:1 100OHM 28SOIC

Datasheet:

Datasheet

Delivery:

Payment:

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DG407DY Specifications

  • Type
    Parameter
  • Supplier Device Package
    28-SOIC
  • Package / Case
    28-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    500pA
  • Channel Capacitance (CS(off), CD(off))
    8pF, 80pF
  • Charge Injection
    40pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    200ns, 150ns
  • Voltage - Supply, Dual (V±)
    ±5V ~ 20V
  • Voltage - Supply, Single (V+)
    5V ~ 34V
  • Channel-to-Channel Matching (ΔRon)
    5Ohm
  • On-State Resistance (Max)
    100Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Bag
  • Product Status
    Obsolete
  • Series
    -
The A2F500M3G-FGG484I is an integrated circuit chip from Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The A2F500M3G-FGG484I chip combines an FPGA (Field-Programmable Gate Array) with a microcontroller subsystem, providing the benefits of both technologies in a single device. 2. Integration: It integrates various components like FPGA fabric, ARM Cortex-M3 processor, programmable analog, and programmable digital peripherals, reducing the need for external components and simplifying the design. 3. Security: The chip offers advanced security features like secure boot, tamper detection, and secure key storage, making it suitable for applications requiring high levels of security. 4. Low power consumption: It is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 processor combination allows for high-performance computing and real-time processing capabilities.Application scenarios: 1. Industrial automation: The A2F500M3G-FGG484I chip can be used in industrial automation systems for tasks like motor control, sensor interfacing, and communication protocols implementation. 2. Internet of Things (IoT): With its integrated microcontroller subsystem and FPGA fabric, the chip can be used in IoT devices for data processing, connectivity, and security functions. 3. Aerospace and defense: The chip's security features, high performance, and low power consumption make it suitable for aerospace and defense applications like avionics systems, secure communication, and military-grade equipment. 4. Medical devices: It can be used in medical devices for tasks like signal processing, data acquisition, and secure communication, where both programmability and security are crucial. 5. Communications: The chip's FPGA fabric can be utilized for implementing custom communication protocols, signal processing, and encryption/decryption algorithms in networking equipment or telecommunications systems.These are just a few examples, and the versatility of the A2F500M3G-FGG484I chip allows it to be used in various other applications where a combination of FPGA and microcontroller capabilities is required.