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NLV74LVX8051DTR2G

NLV74LVX8051DTR2G

Manufacturer No:

NLV74LVX8051DTR2G

Manufacturer:

onsemi

Description:

IC MUX 8:1 25OHM 16TSSOP

Datasheet:

Datasheet

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NLV74LVX8051DTR2G Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TSSOP
  • Package / Case
    16-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -55°C ~ 85°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    100nA
  • Channel Capacitance (CS(off), CD(off))
    10pF
  • Charge Injection
    -
  • -3db Bandwidth
    80MHz
  • Switch Time (Ton, Toff) (Max)
    -
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    2.5V ~ 6V
  • Channel-to-Channel Matching (ΔRon)
    8Ohm
  • On-State Resistance (Max)
    25Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The XCZU48DR-2FSVE1156I is a specific model of integrated circuit (IC) chip from Xilinx. It belongs to the Xilinx Zynq UltraScale+ MPSoC family and offers several advantages and application scenarios. Here are some key points:Advantages: 1. High-performance processing: The XCZU48DR-2FSVE1156I chip combines a powerful Arm Cortex-A53 quad-core processor with programmable logic, enabling high-performance processing capabilities. 2. Programmable logic fabric: The chip includes programmable logic resources, allowing users to implement custom hardware accelerators, interfaces, and other specialized functions. 3. Versatility: The XCZU48DR-2FSVE1156I chip supports a wide range of applications due to its combination of processing power, programmable logic, and various I/O interfaces. 4. Energy efficiency: The chip is designed to optimize power consumption, making it suitable for applications where energy efficiency is crucial. 5. Scalability: The XCZU48DR-2FSVE1156I chip is part of the Zynq UltraScale+ MPSoC family, which offers different models with varying capabilities. This allows for scalability and flexibility in choosing the right chip for specific application requirements.Application Scenarios: 1. Embedded systems: The XCZU48DR-2FSVE1156I chip is commonly used in embedded systems that require a combination of processing power and programmable logic. It can be utilized in applications such as industrial automation, robotics, and automotive systems. 2. High-performance computing: The chip's processing capabilities make it suitable for high-performance computing applications, including data centers, cloud computing, and scientific research. 3. Software-defined networking: The XCZU48DR-2FSVE1156I chip can be used in networking equipment to implement software-defined networking (SDN) functionalities, such as packet processing, traffic management, and virtualization. 4. Video and image processing: The chip's programmable logic fabric can be leveraged to accelerate video and image processing tasks, making it useful in applications like video surveillance, medical imaging, and multimedia systems. 5. Aerospace and defense: The XCZU48DR-2FSVE1156I chip's combination of processing power and programmable logic makes it suitable for aerospace and defense applications, including radar systems, avionics, and communication equipment.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and use cases of the target system.
NLV74LVX8051DTR2G Relevant information