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ISL5122IB

ISL5122IB

Manufacturer No:

ISL5122IB

Manufacturer:

Intersil

Description:

IC SW SPST-NO/NCX2 20OHM 8SOIC

Datasheet:

Datasheet

Delivery:

Payment:

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ISL5122IB Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -105dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    100pA
  • Channel Capacitance (CS(off), CD(off))
    8pF, 8pF
  • Charge Injection
    5pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    35ns, 30ns
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    2.7V ~ 12V
  • Channel-to-Channel Matching (ΔRon)
    800mOhm
  • On-State Resistance (Max)
    20Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO/NC
  • Packaging
    Bag
  • Product Status
    Obsolete
  • Series
    -
The LX2160SN71826B is a specific model of integrated circuit (IC) chip developed by NXP Semiconductors. It belongs to the Layerscape family of multicore processors and is designed for high-performance networking and data center applications. Here are some advantages and application scenarios of the LX2160SN71826B IC chips:Advantages: 1. High Performance: The LX2160SN71826B features 16 ARM Cortex-A72 cores, each capable of running at up to 2.2 GHz. This provides significant processing power for demanding applications. 2. Networking Capabilities: The chip includes integrated Ethernet interfaces, supporting up to 100 Gigabit Ethernet speeds. It also supports various networking protocols, making it suitable for networking equipment and applications. 3. Scalability: The Layerscape family of processors, including the LX2160SN71826B, is designed to be scalable. This means that it can be used in a range of applications, from small-scale systems to large-scale data centers. 4. Power Efficiency: The chip is designed to be power-efficient, helping to reduce energy consumption and heat generation in systems where it is used.Application Scenarios: 1. Networking Equipment: The LX2160SN71826B is commonly used in networking equipment such as routers, switches, and gateways. Its high-performance cores and networking capabilities make it suitable for handling large amounts of network traffic. 2. Data Centers: With its high processing power and networking capabilities, the chip is well-suited for data center applications. It can be used in servers, storage systems, and other infrastructure components to handle compute-intensive tasks and network traffic. 3. Edge Computing: The chip's power efficiency and scalability make it suitable for edge computing applications. It can be used in edge servers or gateways to process data locally, reducing latency and improving overall system performance. 4. Network Function Virtualization (NFV): NFV involves virtualizing network functions, such as firewalls or load balancers, and running them on standard hardware. The LX2160SN71826B can be used in NFV deployments due to its high-performance cores and networking capabilities.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and use cases of the system or product being developed.
ISL5122IB Relevant information