HV2621/R4X

HV2621/R4X

Manufacturer No:

HV2621/R4X

Manufacturer:

Microchip Technology

Description:

IC SWITCH SPST X 1 30OHM 64VQFN

Datasheet:

Datasheet

Delivery:

Payment:

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HV2621/R4X Specifications

  • Type
    Parameter
  • Supplier Device Package
    64-VQFN (9x9)
  • Package / Case
    64-VFQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Crosstalk
    -70dB @ 5MHz
  • Current - Leakage (IS(off)) (Max)
    15µA
  • Channel Capacitance (CS(off), CD(off))
    10pF
  • Charge Injection
    1000pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    6µs, 6µs
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    3V ~ 5.5V
  • Channel-to-Channel Matching (ΔRon)
    1.5Ohm
  • On-State Resistance (Max)
    30Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The 10AS032H2F35E1SG is an integrated circuit chip from Intel's Arria 10 series of field-programmable gate arrays (FPGAs). Here are some advantages and application scenarios of this chip:Advantages: 1. High Performance: The 10AS032H2F35E1SG chip offers high-performance capabilities with a maximum operating frequency of up to 1.5 GHz. It can handle complex tasks and computations efficiently. 2. Programmability: Being an FPGA, this chip is highly programmable, allowing users to customize its functionality according to their specific requirements. It offers flexibility in implementing various digital logic designs. 3. High Logic Density: With 32,000 logic elements (LEs), this chip provides a high logic density, enabling the implementation of complex digital systems on a single chip. 4. Low Power Consumption: The 10AS032H2F35E1SG chip is designed to be power-efficient, making it suitable for applications where power consumption is a concern. 5. High-Speed Interfaces: It supports various high-speed interfaces like PCIe, DDR3, and Gigabit Ethernet, enabling seamless integration with other devices and systems.Application Scenarios: 1. Communications: The high-performance and programmable nature of this chip make it suitable for applications in the communications domain. It can be used in wireless base stations, network switches, routers, and other communication infrastructure equipment. 2. Video and Image Processing: The 10AS032H2F35E1SG chip's high logic density and processing capabilities make it ideal for video and image processing applications. It can be used in video surveillance systems, image recognition, and video transcoding. 3. Industrial Automation: This chip can be utilized in industrial automation systems, such as programmable logic controllers (PLCs), where real-time control and high-speed data processing are required. 4. High-Performance Computing: The 10AS032H2F35E1SG chip's high-performance capabilities make it suitable for applications in the field of high-performance computing (HPC). It can be used in areas like scientific research, data centers, and supercomputing. 5. Aerospace and Defense: The chip's programmability and high-speed interfaces make it applicable in aerospace and defense systems. It can be used in radar systems, avionics, military communication systems, and satellite applications.These are just a few examples of the advantages and application scenarios of the 10AS032H2F35E1SG integrated circuit chip. Its versatility and programmability make it suitable for a wide range of applications in various industries.