ADG527AKPZ

ADG527AKPZ

Manufacturer No:

ADG527AKPZ

Manufacturer:

Analog Devices Inc.

Description:

IC MUX DUAL 8:1 450OHM 28PLCC

Datasheet:

Datasheet

Delivery:

Payment:

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ADG527AKPZ Specifications

  • Type
    Parameter
  • Supplier Device Package
    28-PLCC (11.51x11.51)
  • Package / Case
    28-LCC (J-Lead)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    1nA
  • Channel Capacitance (CS(off), CD(off))
    5pF, 44pF
  • Charge Injection
    4pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    300ns, 300ns
  • Voltage - Supply, Dual (V±)
    ±10.8V ~ 16.5V
  • Voltage - Supply, Single (V+)
    10.8V ~ 16.5V
  • Channel-to-Channel Matching (ΔRon)
    22.5Ohm
  • On-State Resistance (Max)
    450Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The M2S150-FCG1152I is an integrated circuit chip developed by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S150-FCG1152I chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features such as secure boot, tamper detection, and secure key storage. This makes the M2S150-FCG1152I chip suitable for applications that require robust security measures. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 microcontroller subsystem provide high-performance processing capabilities, enabling the chip to handle complex tasks and applications.Application scenarios: 1. Industrial automation: The M2S150-FCG1152I chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. Its flexibility allows for customization to meet specific requirements of different industrial applications. 2. Internet of Things (IoT): With its low power consumption and integration of FPGA and microcontroller, the chip can be used in IoT devices for edge computing, data processing, and connectivity. It can handle real-time data processing and communication tasks efficiently. 3. Aerospace and defense: The security features of the chip make it suitable for aerospace and defense applications that require protection against tampering, secure boot, and secure communication. It can be used in avionics systems, military equipment, and secure communication devices. 4. Medical devices: The chip's versatility and integration make it suitable for medical devices such as patient monitoring systems, medical imaging equipment, and diagnostic devices. It can handle complex algorithms, data processing, and connectivity requirements. 5. Communications: The chip can be used in communication systems for tasks such as protocol conversion, signal processing, and encryption/decryption. Its FPGA fabric can be programmed to support various communication standards and protocols.These are just a few examples of the advantages and application scenarios of the M2S150-FCG1152I chip. Its versatility, integration, security features, low power consumption, and high performance make it suitable for a wide range of applications in different industries.