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DG302ACJ+

DG302ACJ+

Manufacturer No:

DG302ACJ+

Description:

IC SWITCH DPST-NOX2 50OHM 14DIP

Datasheet:

Datasheet

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DG302ACJ+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    14-PDIP
  • Package / Case
    14-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Crosstalk
    -74dB @ 500kHz
  • Current - Leakage (IS(off)) (Max)
    5nA
  • Channel Capacitance (CS(off), CD(off))
    14pF, 14pF
  • Charge Injection
    12pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    300ns, 250ns
  • Voltage - Supply, Dual (V±)
    ±5V ~ 18V
  • Voltage - Supply, Single (V+)
    -
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    50Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    DPST - NO
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The M2S150T-FCG1152 is a specific model of integrated circuit (IC) chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of the M2S150T-FCG1152 IC chip:Advantages: 1. Versatility: The M2S150T-FCG1152 chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family of chips, including the M2S150T-FCG1152, offers advanced security features such as secure boot, tamper detection, and secure key storage. These features make it suitable for applications that require high levels of security, such as industrial control systems, defense, and aerospace. 4. Low power consumption: The M2S150T-FCG1152 chip is designed to be power-efficient, making it suitable for battery-powered or energy-constrained applications. 5. High performance: The FPGA fabric combined with the ARM Cortex-M3 microcontroller subsystem provides high-performance processing capabilities, enabling complex algorithms and real-time processing.Application scenarios: 1. Industrial automation: The M2S150T-FCG1152 chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. Its flexibility allows for customization to specific industrial requirements. 2. Internet of Things (IoT): With its low power consumption and integration capabilities, the chip can be used in IoT devices for edge computing, data processing, and connectivity. 3. Aerospace and defense: The M2S150T-FCG1152 chip's security features, high performance, and reliability make it suitable for aerospace and defense applications, including avionics, radar systems, and secure communication. 4. Medical devices: The chip can be used in medical devices such as patient monitoring systems, medical imaging, and diagnostic equipment, where customization, security, and performance are crucial. 5. Communications: The M2S150T-FCG1152 chip can be utilized in communication systems, including network routers, switches, and base stations, where its FPGA fabric can be programmed to support various protocols and interfaces.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and design considerations of each project.
DG302ACJ+ Relevant information