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DG407DN+

DG407DN+

Manufacturer No:

DG407DN+

Description:

IC MUX DUAL 8:1 100OHM 28PLCC

Datasheet:

Datasheet

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DG407DN+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    28-PLCC (11.51x11.51)
  • Package / Case
    28-LCC (J-Lead)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -92dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    500pA
  • Channel Capacitance (CS(off), CD(off))
    8pF, 65pF
  • Charge Injection
    2pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    200ns, 150ns
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 20V
  • Voltage - Supply, Single (V+)
    5V ~ 30V
  • Channel-to-Channel Matching (ΔRon)
    1.5Ohm
  • On-State Resistance (Max)
    100Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The XCZU3CG-1UBVA530E is a specific model of the Xilinx Zynq UltraScale+ MPSoC family of integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance processing: The XCZU3CG-1UBVA530E chip combines a quad-core ARM Cortex-A53 processor with a dual-core ARM Cortex-R5 real-time processor, along with programmable logic resources. This allows for high-performance processing capabilities, making it suitable for demanding applications.2. Programmable logic: The chip includes programmable logic resources, which can be used to implement custom hardware accelerators, interfaces, or other specialized functionality. This flexibility enables the chip to be tailored to specific application requirements.3. Integrated peripherals: The XCZU3CG-1UBVA530E chip includes a wide range of integrated peripherals such as USB, Ethernet, PCIe, and DDR memory controllers. This reduces the need for additional external components, simplifying system design and reducing costs.4. Low power consumption: The chip is designed to optimize power consumption, making it suitable for power-constrained applications. It includes power management features that allow for dynamic power scaling and fine-grained control over power usage.Application scenarios: 1. Embedded systems: The XCZU3CG-1UBVA530E chip is commonly used in embedded systems where a combination of high-performance processing and programmable logic is required. It can be used in applications such as industrial automation, robotics, and automotive systems.2. Edge computing: With its powerful processing capabilities, the chip is well-suited for edge computing applications. It can perform real-time data processing and analysis at the edge of the network, reducing latency and improving overall system performance.3. High-bandwidth data processing: The XCZU3CG-1UBVA530E chip's integrated peripherals, such as PCIe and DDR memory controllers, make it suitable for applications that require high-bandwidth data processing. This includes areas like high-speed networking, data centers, and video processing.4. Software-defined systems: The chip's combination of processing cores and programmable logic resources makes it ideal for implementing software-defined systems. It can be used to build flexible and reconfigurable systems that can adapt to changing requirements or support multiple functions within a single device.Overall, the XCZU3CG-1UBVA530E chip offers a balance of processing power, flexibility, and power efficiency, making it suitable for a wide range of applications that require high-performance processing and programmable logic capabilities.
DG407DN+ Relevant information