MAX354CPE+
Manufacturer No:
MAX354CPE+
Manufacturer:
Description:
IC MUX 8:1 350OHM 16DIP
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MAX354CPE+ Specifications
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TypeParameter
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Supplier Device Package16-PDIP
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Package / Case16-DIP (0.300", 7.62mm)
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Mounting TypeThrough Hole
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Operating Temperature0°C ~ 70°C (TA)
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Crosstalk-92dB @ 100kHz
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Current - Leakage (IS(off)) (Max)500pA
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Channel Capacitance (CS(off), CD(off))1.6pF, 11pF
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Charge Injection80pC
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-3db Bandwidth-
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Switch Time (Ton, Toff) (Max)250ns, 200ns
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Voltage - Supply, Dual (V±)±4.5V ~ 18V
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Voltage - Supply, Single (V+)4.5V ~ 36V
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Channel-to-Channel Matching (ΔRon)7Ohm
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On-State Resistance (Max)350Ohm
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Number of Circuits1
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Multiplexer/Demultiplexer Circuit8:1
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Switch Circuit-
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PackagingTube
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Product StatusActive
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Series-
The XCZU2CG-1SFVC784I is a specific model of the Xilinx Zynq UltraScale+ MPSoC family of integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The XCZU2CG-1SFVC784I combines a high-performance processing system (Quad-core ARM Cortex-A53) with programmable logic (FPGA) in a single chip. This allows for a wide range of applications and flexibility in system design. 2. High-performance processing: The ARM Cortex-A53 cores provide powerful processing capabilities, enabling complex tasks such as real-time processing, image and signal processing, and high-speed data processing. 3. Programmable logic: The FPGA fabric in the chip allows for hardware acceleration, custom logic implementation, and real-time processing of specific algorithms. It can be reprogrammed to adapt to changing requirements or to optimize performance. 4. Integrated peripherals: The chip includes various peripherals such as USB, Ethernet, PCIe, and memory interfaces, which simplify system integration and reduce the need for external components. 5. Low power consumption: The XCZU2CG-1SFVC784I is designed to be power-efficient, making it suitable for applications with strict power constraints.Application scenarios: 1. Embedded systems: The XCZU2CG-1SFVC784I is commonly used in embedded systems where both high-performance processing and programmable logic are required. It can be used in applications such as industrial automation, robotics, and automotive systems. 2. Edge computing: With its processing power and FPGA fabric, the chip is suitable for edge computing applications where real-time processing and low latency are crucial. It can be used in edge AI, video analytics, and IoT gateways. 3. High-speed data processing: The XCZU2CG-1SFVC784I's FPGA fabric enables high-speed data processing, making it suitable for applications such as software-defined networking, high-frequency trading, and data center acceleration. 4. Aerospace and defense: The chip's combination of processing power and programmable logic makes it suitable for aerospace and defense applications, including radar systems, avionics, and secure communication systems. 5. Medical imaging: The XCZU2CG-1SFVC784I can be used in medical imaging systems, such as ultrasound machines or CT scanners, where real-time processing and high-performance computing are required for image reconstruction and analysis.These are just a few examples, and the XCZU2CG-1SFVC784I can be applied in various other domains where a combination of processing power and programmable logic is needed.
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