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MAX4602EWE+

MAX4602EWE+

Manufacturer No:

MAX4602EWE+

Description:

IC SW SPST-NOX4 2.5OHM 16SOIC

Datasheet:

Datasheet

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MAX4602EWE+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -59dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    500pA
  • Channel Capacitance (CS(off), CD(off))
    55pF, 55pF
  • Charge Injection
    120pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    250ns, 350ns
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 20V
  • Voltage - Supply, Single (V+)
    4.5V ~ 36V
  • Channel-to-Channel Matching (ΔRon)
    100mOhm
  • On-State Resistance (Max)
    2.5Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The M2S060TS-FG484 integrated circuit chip is a member of the SmartFusion2 family of system-on-chip (SoC) devices developed by Microsemi Corporation. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S060TS-FG484 chip combines an FPGA fabric with a hard ARM Cortex-M3 processor, offering the flexibility of programmable logic and the processing power of a microcontroller in a single device. 2. Integration: The chip integrates various peripherals, including UART, SPI, I2C, GPIO, timers, and memory controllers, reducing the need for external components and simplifying system design. 3. Security: SmartFusion2 devices incorporate security features such as secure boot, tamper detection, and bitstream encryption, making them suitable for applications requiring robust security measures. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High reliability: SmartFusion2 devices are built with reliability features like single-event upset (SEU) mitigation, making them suitable for applications in harsh environments or aerospace and defense sectors.Application scenarios: 1. Industrial automation: The M2S060TS-FG484 chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols implementation. 2. Internet of Things (IoT): With its combination of programmable logic and a microcontroller, the chip can be used in IoT devices for edge computing, data processing, and connectivity. 3. Automotive: The chip's security features and integration capabilities make it suitable for automotive applications like advanced driver-assistance systems (ADAS), infotainment systems, and vehicle networking. 4. Aerospace and defense: The reliability features and security measures of the chip make it suitable for aerospace and defense applications, including avionics, military communication systems, and secure data processing. 5. Medical devices: The chip's low power consumption, integration, and security features make it suitable for medical devices such as patient monitoring systems, portable diagnostic devices, and implantable devices.These are just a few examples of the advantages and application scenarios of the M2S060TS-FG484 integrated circuit chip. The versatility and features of the chip make it suitable for a wide range of applications across various industries.
MAX4602EWE+ Relevant information