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MAX4661CWE+

MAX4661CWE+

Manufacturer No:

MAX4661CWE+

Description:

IC SW SPST-NCX4 2.5OHM 16SOIC

Datasheet:

Datasheet

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MAX4661CWE+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Crosstalk
    -59dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    500pA
  • Channel Capacitance (CS(off), CD(off))
    55pF, 55pF
  • Charge Injection
    300pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    275ns, 175ns
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 20V
  • Voltage - Supply, Single (V+)
    4.5V ~ 36V
  • Channel-to-Channel Matching (ΔRon)
    100mOhm
  • On-State Resistance (Max)
    2.5Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NC
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The XCZU7CG-1FFVC1156I is a specific model of the Xilinx Zynq UltraScale+ MPSoC family of integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance processing: The XCZU7CG-1FFVC1156I chip combines a quad-core ARM Cortex-A53 processor with a dual-core ARM Cortex-R5 real-time processor, along with programmable logic resources. This allows for high-performance processing capabilities, making it suitable for demanding applications.2. Programmable logic: The chip includes programmable logic resources, which can be used to implement custom hardware accelerators, interfaces, or other specialized functionality. This flexibility enables the chip to be tailored to specific application requirements.3. Integrated peripherals: The XCZU7CG-1FFVC1156I chip includes a wide range of integrated peripherals such as USB, Ethernet, PCIe, and DDR memory controllers. This reduces the need for additional external components, simplifying system design and reducing costs.4. Power efficiency: The chip is designed to be power-efficient, with power management features that allow for dynamic power scaling and optimization. This is particularly beneficial for applications that require low power consumption or operate on battery power.Application scenarios: 1. Embedded systems: The XCZU7CG-1FFVC1156I chip is well-suited for embedded systems that require a combination of high-performance processing and programmable logic. It can be used in applications such as industrial automation, robotics, and automotive systems.2. Edge computing: With its powerful processing capabilities and integrated peripherals, the chip can be used in edge computing applications. It can perform real-time data processing and analysis at the edge of the network, reducing latency and improving overall system performance.3. High-bandwidth data processing: The XCZU7CG-1FFVC1156I chip's integrated peripherals, including high-speed serial interfaces like PCIe, make it suitable for applications that require high-bandwidth data processing. This includes areas such as high-performance computing, data centers, and network infrastructure.4. Software-defined systems: The chip's combination of processing cores and programmable logic resources makes it ideal for implementing software-defined systems. It can be used to build flexible and reconfigurable systems that can adapt to changing requirements or support multiple functions within a single device.Overall, the XCZU7CG-1FFVC1156I chip offers a balance of processing power, programmability, and integrated peripherals, making it suitable for a wide range of applications that require high-performance processing and customization capabilities.
MAX4661CWE+ Relevant information