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MAX326CEE+

MAX326CEE+

Manufacturer No:

MAX326CEE+

Description:

IC SW SPST-NCX4 3.5KOHM 16QSOP

Datasheet:

Datasheet

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MAX326CEE+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-QSOP
  • Package / Case
    16-SSOP (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Crosstalk
    -90dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    10pA
  • Channel Capacitance (CS(off), CD(off))
    1.7pF, 1.7pF
  • Charge Injection
    2pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    1µs, 500ns
  • Voltage - Supply, Dual (V±)
    ±5V ~ 18V
  • Voltage - Supply, Single (V+)
    10V ~ 30V
  • Channel-to-Channel Matching (ΔRon)
    175Ohm
  • On-State Resistance (Max)
    3.5kOhm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NC
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The XCZU47DR-2FSVG1517I is a specific model of integrated circuit (IC) chip manufactured by Xilinx. It belongs to the Xilinx Zynq UltraScale+ MPSoC family and offers several advantages and application scenarios. Here are some key points:Advantages: 1. High-performance processing: The XCZU47DR-2FSVG1517I chip combines a powerful Arm Cortex-A53 quad-core processor with a programmable logic fabric, enabling high-performance processing capabilities. 2. Programmable logic fabric: The chip includes programmable logic resources, allowing users to implement custom hardware accelerators, interfaces, and other specialized functions. 3. Versatility: The XCZU47DR-2FSVG1517I chip supports a wide range of applications due to its combination of processing power and programmable logic, making it suitable for various industries and use cases. 4. Integrated peripherals: The chip includes various integrated peripherals such as USB, Ethernet, PCIe, and memory controllers, reducing the need for additional external components. 5. Low power consumption: The XCZU47DR-2FSVG1517I chip is designed to be power-efficient, making it suitable for applications where energy consumption is a concern.Application Scenarios: 1. Embedded systems: The XCZU47DR-2FSVG1517I chip is commonly used in embedded systems where high-performance processing and programmable logic are required. It can be utilized in applications such as industrial automation, robotics, and automotive systems. 2. Edge computing: With its processing power and programmable logic, the chip is suitable for edge computing applications. It can perform real-time data processing and analysis at the edge of a network, enabling faster response times and reduced latency. 3. High-performance computing: The XCZU47DR-2FSVG1517I chip can be used in high-performance computing applications that require parallel processing and hardware acceleration. It can handle computationally intensive tasks efficiently. 4. Networking and communication: The chip's integrated peripherals and processing capabilities make it suitable for networking and communication applications. It can be used in routers, switches, and network appliances to handle data processing, packet forwarding, and protocol offloading. 5. Video and image processing: The XCZU47DR-2FSVG1517I chip's high-performance processing and programmable logic make it well-suited for video and image processing applications. It can be used in video surveillance systems, image recognition, and computer vision applications.These are just a few examples of the advantages and application scenarios of the XCZU47DR-2FSVG1517I chip. The versatility and capabilities of the chip make it suitable for a wide range of applications where high-performance processing and programmable logic are required.
MAX326CEE+ Relevant information