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MAX4614EPD+

MAX4614EPD+

Manufacturer No:

MAX4614EPD+

Description:

IC SWITCH SPST-NOX4 10OHM 14DIP

Datasheet:

Datasheet

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MAX4614EPD+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    14-PDIP
  • Package / Case
    14-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -96dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    1nA
  • Channel Capacitance (CS(off), CD(off))
    5pF, 5pF
  • Charge Injection
    6.5pC
  • -3db Bandwidth
    70MHz
  • Switch Time (Ton, Toff) (Max)
    12ns, 10ns
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    2V ~ 5.5V
  • Channel-to-Channel Matching (ΔRon)
    200mOhm
  • On-State Resistance (Max)
    10Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The XC7Z030-L2FBG676I is a specific model of the Xilinx Zynq-7000 family of integrated circuit (IC) chips. These chips combine a dual-core ARM Cortex-A9 processor with programmable logic, making them suitable for a wide range of applications. Here are some advantages and application scenarios of the XC7Z030-L2FBG676I:Advantages: 1. High-performance processing: The dual-core ARM Cortex-A9 processor provides high-performance processing capabilities, making it suitable for applications that require significant computational power. 2. Programmable logic: The programmable logic fabric allows for the implementation of custom hardware accelerators, enabling the chip to be tailored to specific application requirements. 3. Low power consumption: The XC7Z030-L2FBG676I is designed to be power-efficient, making it suitable for battery-powered or energy-constrained applications. 4. Integrated peripherals: The chip includes a wide range of integrated peripherals such as USB, Ethernet, UART, SPI, I2C, and GPIO, reducing the need for additional external components.Application scenarios: 1. Embedded systems: The XC7Z030-L2FBG676I is commonly used in embedded systems where a combination of high-performance processing and programmable logic is required. This includes applications such as industrial automation, robotics, and automotive systems. 2. Internet of Things (IoT): The chip's low power consumption and integrated peripherals make it suitable for IoT applications, including smart home devices, wearable technology, and sensor networks. 3. High-performance computing: The XC7Z030-L2FBG676I can be used in high-performance computing applications that require both powerful processing capabilities and the ability to implement custom hardware accelerators. 4. Video and image processing: The chip's computational power and programmable logic make it suitable for video and image processing applications, including surveillance systems, video analytics, and medical imaging. 5. Communication systems: The XC7Z030-L2FBG676I can be used in communication systems such as routers, switches, and base stations, where it can handle both the processing requirements and the implementation of custom communication protocols.It's important to note that the specific application scenarios may vary depending on the requirements and constraints of the project.
MAX4614EPD+ Relevant information