MAX4514ESA+
Manufacturer No:
MAX4514ESA+
Manufacturer:
Description:
IC SWITCH SPST-NOX1 20OHM 8SOIC
Datasheet:
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In Stock : 5
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MAX4514ESA+ Specifications
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TypeParameter
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Supplier Device Package8-SOIC
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Package / Case8-SOIC (0.154", 3.90mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C (TA)
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Crosstalk-
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Current - Leakage (IS(off)) (Max)1nA
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Channel Capacitance (CS(off), CD(off))14pF, 14pF
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Charge Injection2pC
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-3db Bandwidth-
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Switch Time (Ton, Toff) (Max)150ns, 100ns
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Voltage - Supply, Dual (V±)-
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Voltage - Supply, Single (V+)2V ~ 12V
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Channel-to-Channel Matching (ΔRon)-
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On-State Resistance (Max)20Ohm
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Number of Circuits1
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Multiplexer/Demultiplexer Circuit1:1
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Switch CircuitSPST - NO
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PackagingTube
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Product StatusActive
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Series-
The M2S090TS-FCSG325 is an integrated circuit chip developed by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S090TS-FCSG325 chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family of chips, including the M2S090TS-FCSG325, offers advanced security features such as secure boot, tamper detection, and secure key storage. These features make it suitable for applications that require high levels of security. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications.Application scenarios: 1. Industrial automation: The M2S090TS-FCSG325 chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. The FPGA fabric allows for customization and adaptation to specific industrial requirements. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller subsystem, the chip can be used in IoT applications for edge computing, data processing, and connectivity. The security features also make it suitable for secure IoT deployments. 3. Aerospace and defense: The chip's security features, low power consumption, and integration make it suitable for aerospace and defense applications. It can be used in avionics systems, secure communication systems, and military-grade equipment. 4. Medical devices: The chip's versatility and low power consumption make it suitable for medical devices such as patient monitoring systems, portable diagnostic devices, and medical imaging equipment. 5. Communications: The chip can be used in communication systems for tasks such as protocol conversion, signal processing, and encryption/decryption.These are just a few examples of the advantages and application scenarios of the M2S090TS-FCSG325 chip. The versatility and integration of this chip make it suitable for a wide range of applications across various industries.
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