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BU4052BCF-E2

BU4052BCF-E2

Manufacturer No:

BU4052BCF-E2

Manufacturer:

Description:

IC SWITCH SP4T X 2 160OHM 16SOP

Datasheet:

Datasheet

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BU4052BCF-E2 Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOP
  • Package / Case
    16-SOIC (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    300nA
  • Channel Capacitance (CS(off), CD(off))
    10pF
  • Charge Injection
    -
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    -
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    3V ~ 18V
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    160Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    4:1
  • Switch Circuit
    SP4T
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The SVF322R3K2CKU2 integrated circuit chips have several advantages and can be applied in various scenarios. Some of the advantages and application scenarios are:Advantages: 1. High Performance: The SVF322R3K2CKU2 chips offer high-performance capabilities, enabling them to handle complex tasks and applications efficiently. 2. Superior Connectivity: These chips provide excellent connectivity options, ensuring seamless communication and data transfer between different components or systems. 3. Low Power Consumption: The chips are designed to consume minimal power, making them suitable for applications where energy efficiency is important. 4. Compact Size: The SVF322R3K2CKU2 chips come in compact sizes, allowing for space-saving integration into various devices or systems. 5. Cost-Effective: These chips offer a cost-effective solution for implementing advanced features and functionalities in electronic devices.Application Scenarios: 1. Internet of Things (IoT): The SVF322R3K2CKU2 chips can be used in IoT devices to enable connectivity, data processing, and control functions, facilitating the implementation of smart and interconnected systems. 2. Industrial Automation: These chips are suitable for control systems in industrial automation, providing high-performance computing capabilities and efficient connectivity for real-time data processing and control tasks. 3. Robotics: The chips can be utilized in robotics applications to enable efficient processing, control, and communication between different robotic components, enhancing their overall performance. 4. Communication Systems: These chips can be employed in communication systems such as routers, switches, and network equipment to enable high-speed data processing, routing, and connectivity. 5. Consumer Electronics: The SVF322R3K2CKU2 chips can be integrated into consumer electronics devices like smartphones, tablets, or smart TVs, providing advanced processing capabilities and improved connectivity features.These are just a few examples of the advantages and application scenarios of SVF322R3K2CKU2 integrated circuit chips, and there may be other specific uses depending on the requirements of a particular system or device.
BU4052BCF-E2 Relevant information