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NX3L2T66GT,115

NX3L2T66GT,115

Manufacturer No:

NX3L2T66GT,115

Manufacturer:

NXP USA Inc.

Description:

IC SW SPST-NOX2 750MOHM 8XSON

Datasheet:

Datasheet

Delivery:

Payment:

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NX3L2T66GT,115 Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-XSON, SOT833-1 (1.95x1)
  • Package / Case
    8-XFDFN
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Crosstalk
    -90dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    10nA
  • Channel Capacitance (CS(off), CD(off))
    35pF
  • Charge Injection
    6pC
  • -3db Bandwidth
    60MHz
  • Switch Time (Ton, Toff) (Max)
    28ns, 20ns
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    1.4V ~ 4.3V
  • Channel-to-Channel Matching (ΔRon)
    20mOhm
  • On-State Resistance (Max)
    750mOhm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The IDT79RC32V332-150DH is a specific model of integrated circuit (IC) chip manufactured by Integrated Device Technology (IDT). While specific advantages and application scenarios may vary depending on the requirements and use cases, here are some general advantages and potential application scenarios for this chip:Advantages: 1. High Performance: The IDT79RC32V332-150DH is designed to offer high performance with a clock frequency of 150 MHz. This makes it suitable for applications that require fast processing and data transfer rates. 2. Low Power Consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered devices or applications where power efficiency is crucial. 3. Integrated Features: The IDT79RC32V332-150DH integrates various features such as a 32-bit RISC processor, memory management unit (MMU), cache, and peripherals. This integration simplifies the design process and reduces the need for additional external components. 4. Scalability: The chip supports various memory configurations, allowing for scalability based on the specific application requirements. This flexibility makes it suitable for a wide range of applications.Application Scenarios: 1. Embedded Systems: The IDT79RC32V332-150DH can be used in embedded systems that require high-performance processing capabilities, such as industrial automation, robotics, or automotive applications. 2. Communication Systems: The chip's integrated features and high clock frequency make it suitable for communication systems that require fast data processing and transfer, such as network routers, switches, or wireless base stations. 3. Consumer Electronics: The low power consumption and integrated features of the chip make it suitable for consumer electronics applications, including smart home devices, wearable devices, or portable multimedia players. 4. Internet of Things (IoT): The chip's scalability and low power consumption make it suitable for IoT applications, where it can be used in sensor nodes, edge devices, or gateways that require efficient processing and connectivity.It's important to note that the specific advantages and application scenarios may vary based on the requirements and specifications of the target application. It is recommended to refer to the datasheet and technical documentation provided by IDT for detailed information and suitability for specific use cases.
NX3L2T66GT,115 Relevant information