XS3A1T5157GSH
Manufacturer No:
XS3A1T5157GSH
Manufacturer:
Description:
IC SWITCH SPDT X 1 900MOHM 6XSON
Datasheet:
Delivery:
Payment:
In Stock : 0
Please send RFQ , we will respond immediately.
XS3A1T5157GSH Specifications
-
TypeParameter
-
Supplier Device Package6-XSON, SOT1202 (1x1)
-
Package / Case6-XFDFN
-
Mounting TypeSurface Mount
-
Operating Temperature-40°C ~ 125°C (TA)
-
Crosstalk-90dB @ 100kHz
-
Current - Leakage (IS(off)) (Max)10nA
-
Channel Capacitance (CS(off), CD(off))35pF
-
Charge Injection15pC
-
-3db Bandwidth40MHz
-
Switch Time (Ton, Toff) (Max)40ns, 20ns
-
Voltage - Supply, Dual (V±)-
-
Voltage - Supply, Single (V+)1.4V ~ 4.3V
-
Channel-to-Channel Matching (ΔRon)100mOhm
-
On-State Resistance (Max)900mOhm
-
Number of Circuits1
-
Multiplexer/Demultiplexer Circuit2:1
-
Switch CircuitSPDT
-
PackagingCut Tape (CT)
-
PackagingTape & Reel (TR)
-
Product StatusActive
-
Series-
The UPD720231AK8-612-BAE is a specific model of integrated circuit (IC) chip manufactured by Renesas Electronics. While specific advantages and application scenarios may vary depending on the specific requirements and use cases, here are some general advantages and potential application scenarios for this IC chip:Advantages: 1. High-performance: The UPD720231AK8-612-BAE is designed to deliver high-performance capabilities, making it suitable for demanding applications. 2. Low power consumption: This IC chip is designed to operate with low power consumption, making it suitable for battery-powered devices or energy-efficient applications. 3. Compact size: The chip's compact size allows for easy integration into various electronic devices, including portable devices or space-constrained applications. 4. Versatility: The UPD720231AK8-612-BAE is a versatile chip that can be used in a wide range of applications, providing flexibility in design and implementation.Application Scenarios: 1. Consumer Electronics: This IC chip can be used in various consumer electronics devices such as smartphones, tablets, digital cameras, portable media players, or gaming consoles, where high-performance and low power consumption are crucial. 2. Industrial Automation: The chip's high-performance capabilities make it suitable for industrial automation applications, including robotics, control systems, or factory automation equipment. 3. Automotive Electronics: The UPD720231AK8-612-BAE can be used in automotive electronics applications, such as infotainment systems, advanced driver-assistance systems (ADAS), or vehicle control units. 4. Internet of Things (IoT): With its low power consumption and compact size, this IC chip can be used in IoT devices, including smart home devices, wearables, or sensor nodes, where energy efficiency and small form factor are essential. 5. Communication Systems: The chip's high-performance capabilities make it suitable for communication systems, including routers, switches, or network equipment, where fast data processing and low power consumption are required.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the project or product. It is recommended to consult the datasheet and technical documentation provided by the manufacturer for detailed information on the UPD720231AK8-612-BAE chip.
XS3A1T5157GSH Relevant information
-
DG509AAZ/883B
Analog Devices Inc./Maxim Integrated -
TS12A4514PE4
Analog Devices Inc. -
TS3A24159DGSR
Analog Devices Inc. -
TS12A4515DBVR
Analog Devices Inc. -
SW202NBC
NXP Semiconductors -
MAX464CNI
NXP Semiconductors -
MC74HC4051ADWR2G
NXP Semiconductors -
74LVC1G3157GWXL
Nexperia USA Inc. -
SW202NBC
NXP Semiconductors -
TDA3683J/N2S,112
Analog Devices Inc.