ADG5421BRMZ
Manufacturer No:
ADG5421BRMZ
Manufacturer:
Description:
IC SWITCH SPST-NOX2 14OHM 10MSOP
Datasheet:
Delivery:
Payment:
In Stock : 13
Please send RFQ , we will respond immediately.
ADG5421BRMZ Specifications
-
TypeParameter
-
Supplier Device Package10-MSOP
-
Package / Case10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
-
Mounting TypeSurface Mount
-
Operating Temperature-40°C ~ 125°C (TA)
-
Crosstalk-85dB @ 1MHz
-
Current - Leakage (IS(off)) (Max)250pA
-
Channel Capacitance (CS(off), CD(off))11pF, 12pF
-
Charge Injection120pC
-
-3db Bandwidth250MHz
-
Switch Time (Ton, Toff) (Max)199ns, 184ns
-
Voltage - Supply, Dual (V±)±9V ~ 22V
-
Voltage - Supply, Single (V+)9V ~ 40V
-
Channel-to-Channel Matching (ΔRon)100mOhm
-
On-State Resistance (Max)14Ohm
-
Number of Circuits2
-
Multiplexer/Demultiplexer Circuit1:1
-
Switch CircuitSPST - NO
-
PackagingTube
-
Product StatusActive
-
Series-
The XCZU11EG-L1FFVC1156I is a specific model of the Xilinx Zynq UltraScale+ MPSoC family of integrated circuit chips. These chips combine a high-performance processing system with programmable logic, making them suitable for a wide range of applications. Here are some advantages and application scenarios of the XCZU11EG-L1FFVC1156I:Advantages: 1. High-performance processing: The XCZU11EG-L1FFVC1156I chip features a quad-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 real-time processor, and an ARM Mali-400 MP2 GPU. This combination provides high-performance processing capabilities for demanding applications.2. Programmable logic: The chip also includes programmable logic resources, allowing users to implement custom hardware accelerators or interface with external devices. This flexibility enables the chip to be tailored to specific application requirements.3. Integrated peripherals: The XCZU11EG-L1FFVC1156I chip includes a wide range of integrated peripherals, such as USB, Ethernet, PCIe, and various serial interfaces. These peripherals simplify system design and reduce the need for additional external components.4. Low power consumption: The chip is designed to optimize power consumption, making it suitable for power-constrained applications. It includes power management features that allow dynamic power scaling based on workload requirements.Application scenarios: 1. Embedded systems: The XCZU11EG-L1FFVC1156I chip is commonly used in embedded systems that require high-performance processing and programmable logic capabilities. It can be used in applications such as industrial automation, robotics, and automotive systems.2. Edge computing: With its powerful processing capabilities, the chip is suitable for edge computing applications where real-time processing and low latency are critical. It can be used in scenarios such as video analytics, machine vision, and real-time control systems.3. High-performance computing: The XCZU11EG-L1FFVC1156I chip can be used in high-performance computing applications that require both processing power and programmable logic resources. It can accelerate computationally intensive tasks and enable the implementation of custom algorithms.4. Wireless communication: The chip's integrated peripherals, such as Ethernet and PCIe, make it suitable for wireless communication applications. It can be used in wireless base stations, software-defined radios, and other wireless infrastructure equipment.Overall, the XCZU11EG-L1FFVC1156I chip offers a combination of high-performance processing, programmable logic, and integrated peripherals, making it versatile for a wide range of applications in various industries.
ADG5421BRMZ Relevant information
-
DG509AAZ/883B
Analog Devices Inc./Maxim Integrated -
TS12A4514PE4
Analog Devices Inc. -
TS3A24159DGSR
Analog Devices Inc. -
TS12A4515DBVR
Analog Devices Inc. -
SW202NBC
NXP Semiconductors -
MAX464CNI
NXP Semiconductors -
MC74HC4051ADWR2G
NXP Semiconductors -
74LVC1G3157GWXL
Nexperia USA Inc. -
SW202NBC
NXP Semiconductors -
TDA3683J/N2S,112
Analog Devices Inc.