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ADG1223BRMZ

ADG1223BRMZ

Manufacturer No:

ADG1223BRMZ

Manufacturer:

Analog Devices Inc.

Description:

IC SW SPST-NO/NCX2 200OHM 10MSOP

Datasheet:

Datasheet

Delivery:

Payment:

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ADG1223BRMZ Specifications

  • Type
    Parameter
  • Supplier Device Package
    10-MSOP
  • Package / Case
    10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Crosstalk
    -90dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    100pA
  • Channel Capacitance (CS(off), CD(off))
    2.2pF, 2.2pF
  • Charge Injection
    0.1pC
  • -3db Bandwidth
    960MHz
  • Switch Time (Ton, Toff) (Max)
    130ns, 105ns
  • Voltage - Supply, Dual (V±)
    ±5V ~ 16.5V
  • Voltage - Supply, Single (V+)
    5V ~ 16.5V
  • Channel-to-Channel Matching (ΔRon)
    2.5Ohm
  • On-State Resistance (Max)
    200Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO/NC
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The XCZU43DR-2FFVG1517I is a specific model of integrated circuit (IC) chip from Xilinx. It belongs to the Xilinx Zynq UltraScale+ MPSoC family and offers several advantages and application scenarios. Here are some key points:Advantages: 1. High-performance processing: The XCZU43DR-2FFVG1517I chip combines a powerful Arm Cortex-A53 quad-core processor with programmable logic, enabling high-performance processing capabilities. 2. Programmable logic fabric: The chip includes programmable logic resources, allowing users to implement custom hardware accelerators, interfaces, and other specialized functions. 3. Versatility: With a combination of processing power and programmable logic, the chip can be used in a wide range of applications, offering flexibility and adaptability. 4. Integrated peripherals: The XCZU43DR-2FFVG1517I chip includes various integrated peripherals such as USB, Ethernet, PCIe, and memory controllers, reducing the need for additional external components. 5. Low power consumption: The chip is designed to optimize power efficiency, making it suitable for applications where power consumption is a critical factor.Application Scenarios: 1. Embedded systems: The XCZU43DR-2FFVG1517I chip is commonly used in embedded systems that require both processing power and customizable hardware acceleration. It can be used in applications such as industrial automation, robotics, and automotive systems. 2. High-performance computing: The chip's processing capabilities make it suitable for high-performance computing applications, including data centers, cloud computing, and scientific research. 3. Software-defined networking: With its programmable logic fabric, the chip can be used in software-defined networking applications, enabling the implementation of custom network functions and protocols. 4. Video and image processing: The XCZU43DR-2FFVG1517I chip's processing power and integrated peripherals make it suitable for video and image processing applications, including video surveillance, medical imaging, and multimedia systems. 5. Internet of Things (IoT): The chip's versatility and low power consumption make it suitable for IoT applications, where it can be used for edge computing, sensor data processing, and connectivity.These are just a few examples of the advantages and application scenarios of the XCZU43DR-2FFVG1517I chip. The specific usage will depend on the requirements and needs of the project or application.
ADG1223BRMZ Relevant information