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MC14067BDWR2G

MC14067BDWR2G

Manufacturer No:

MC14067BDWR2G

Manufacturer:

onsemi

Description:

IC MUX 16:1 280OHM 24SOIC

Datasheet:

Datasheet

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MC14067BDWR2G Specifications

  • Type
    Parameter
  • Supplier Device Package
    24-SOIC
  • Package / Case
    24-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -55°C ~ 125°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    100nA
  • Channel Capacitance (CS(off), CD(off))
    100pF
  • Charge Injection
    -
  • -3db Bandwidth
    15MHz
  • Switch Time (Ton, Toff) (Max)
    -
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    3V ~ 18V
  • Channel-to-Channel Matching (ΔRon)
    10Ohm
  • On-State Resistance (Max)
    280Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    16:1
  • Switch Circuit
    -
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The XCZU49DR-L2FSVF1760I is a specific model of integrated circuit (IC) chip from Xilinx. It belongs to the Xilinx Zynq UltraScale+ MPSoC family and offers several advantages and application scenarios. Here are some key points:Advantages: 1. High-performance processing: The XCZU49DR-L2FSVF1760I chip combines a quad-core ARM Cortex-A53 processor with a dual-core ARM Cortex-R5 real-time processor, along with programmable logic resources. This allows for high-performance processing capabilities, making it suitable for demanding applications. 2. Programmable logic: The chip includes programmable logic resources, which can be customized and reconfigured to implement specific functions or accelerate certain algorithms. This flexibility is advantageous for applications that require hardware acceleration or specialized processing. 3. Integrated peripherals: The chip integrates various peripherals, such as USB, Ethernet, PCIe, and DDR memory controllers. This simplifies system design and reduces the need for external components, making it suitable for applications that require connectivity and memory interfaces. 4. Power efficiency: The XCZU49DR-L2FSVF1760I chip is designed to be power-efficient, offering a balance between performance and energy consumption. This is beneficial for applications that require high processing power while minimizing power consumption.Application scenarios: 1. Embedded systems: The XCZU49DR-L2FSVF1760I chip is commonly used in embedded systems that require a combination of processing power, programmability, and connectivity. It can be used in applications such as industrial automation, robotics, and automotive systems. 2. High-performance computing: The chip's processing capabilities and programmable logic make it suitable for high-performance computing applications. It can be used for tasks like data analytics, signal processing, and machine learning. 3. Networking and communication: With integrated peripherals like Ethernet and PCIe, the chip is well-suited for networking and communication applications. It can be used in routers, switches, network appliances, and wireless communication systems. 4. Aerospace and defense: The XCZU49DR-L2FSVF1760I chip's combination of processing power and real-time capabilities makes it suitable for aerospace and defense applications. It can be used in radar systems, avionics, and military communication systems.These are just a few examples of the advantages and application scenarios of the XCZU49DR-L2FSVF1760I chip. The specific usage depends on the requirements of the system and the capabilities of the chip.
MC14067BDWR2G Relevant information