DG418LEDY-T1-GE4
Manufacturer No:
DG418LEDY-T1-GE4
Manufacturer:
Description:
IC SWITCH SPST X 1 9OHM 8SO
Datasheet:
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In Stock : 7
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DG418LEDY-T1-GE4 Specifications
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TypeParameter
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Supplier Device Package8-SO
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Package / Case8-SOIC (0.154", 3.90mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C
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Crosstalk-72dB @ 1MHz
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Current - Leakage (IS(off)) (Max)10nA
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Channel Capacitance (CS(off), CD(off))11pF, 32pF
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Charge Injection26pC
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-3db Bandwidth-
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Switch Time (Ton, Toff) (Max)40ns, 35ns
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Voltage - Supply, Dual (V±)±3V ~ 8V
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Voltage - Supply, Single (V+)3V ~ 16V
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Channel-to-Channel Matching (ΔRon)-
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On-State Resistance (Max)9Ohm
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Number of Circuits1
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Multiplexer/Demultiplexer Circuit1:1
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Switch CircuitSPST
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PackagingCut Tape (CT)
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PackagingTape & Reel (TR)
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Product StatusActive
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Series-
The MPC850DEVR66BU is a specific model of the MPC850 PowerQUICC microprocessor family developed by Freescale Semiconductor (now NXP Semiconductors). This microprocessor chip offers several advantages and can be used in various application scenarios. Some of the advantages and application scenarios of the MPC850DEVR66BU integrated circuit chips are:Advantages: 1. High Performance: The MPC850DEVR66BU chip is based on the PowerQUICC architecture, which provides high-performance computing capabilities. It has a 66 MHz clock speed and a powerful PowerPC core, making it suitable for demanding applications.2. Integrated Features: The chip integrates various peripherals and interfaces, including Ethernet, UART, I2C, SPI, and timers. This integration reduces the need for additional external components, simplifying the design and reducing costs.3. Low Power Consumption: The MPC850DEVR66BU chip is designed to be power-efficient, making it suitable for applications where power consumption is a concern. It incorporates power management features to optimize power usage.4. Industrial Temperature Range: The chip is designed to operate reliably in industrial temperature ranges, typically from -40°C to +85°C. This makes it suitable for applications in harsh environments where temperature fluctuations are common.Application Scenarios: 1. Networking Equipment: The MPC850DEVR66BU chip's integrated Ethernet interface and high-performance computing capabilities make it suitable for networking equipment such as routers, switches, and gateways. It can handle data processing, routing, and communication tasks efficiently.2. Industrial Automation: The chip's industrial temperature range and integrated features make it suitable for industrial automation applications. It can be used in programmable logic controllers (PLCs), motor control systems, and other automation devices.3. Embedded Systems: The MPC850DEVR66BU chip's combination of performance, low power consumption, and integrated peripherals makes it suitable for various embedded systems. It can be used in applications such as automotive electronics, medical devices, and consumer electronics.4. Communication Systems: The chip's high-performance computing capabilities and integrated interfaces make it suitable for communication systems. It can be used in applications such as wireless base stations, telecommunication switches, and network appliances.Overall, the MPC850DEVR66BU integrated circuit chip offers high performance, integrated features, low power consumption, and industrial temperature range, making it suitable for a wide range of applications in networking, industrial automation, embedded systems, and communication systems.
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