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MAX392CSE+

MAX392CSE+

Manufacturer No:

MAX392CSE+

Description:

IC SWITCH SPST-NOX4 35OHM 16SOIC

Datasheet:

Datasheet

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MAX392CSE+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Crosstalk
    -85dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    100pA
  • Channel Capacitance (CS(off), CD(off))
    9pF, 9pF
  • Charge Injection
    2pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    130ns, 75ns
  • Voltage - Supply, Dual (V±)
    ±3V ~ 8V
  • Voltage - Supply, Single (V+)
    3V ~ 15V
  • Channel-to-Channel Matching (ΔRon)
    300mOhm
  • On-State Resistance (Max)
    35Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The XC7Z007S-1CLG225I is an integrated circuit chip from Xilinx, used for a wide range of applications. Here are its advantages and application scenarios:Advantages:1. High-performance processing: The XC7Z007S-1CLG225I chip is based on the Zynq-7000 architecture, which combines a dual-core ARM Cortex-A9 processor with programmable logic resources. This allows for high-performance processing capabilities, including real-time processing and high-speed data movement.2. Programmable logic integration: The chip includes programmable logic resources that can be customized to suit specific application requirements. This flexibility allows for a wide range of applications and enables hardware acceleration, algorithm implementation, and IP integration.3. Power efficiency: The XC7Z007S-1CLG225I chip is designed to be power-efficient, making it suitable for applications with low-power requirements. This is achieved through power management features and dynamic power gating, which reduces power consumption when not needed.4. System integration: With its dual-core processor and programmable logic resources, the chip offers significant system integration capabilities. It can integrate different functions and interfaces, reducing the need for multiple chips and simplifying the overall system design.Application scenarios:1. Embedded systems: The XC7Z007S-1CLG225I chip is commonly used in embedded systems, where the combination of processing power and programmable logic integration is required. It can be used in various domains such as industrial automation, robotics, automotive electronics, and medical devices.2. Internet of Things (IoT): The chip's power efficiency and system integration capabilities make it suitable for IoT applications. It can handle sensor data processing, communication protocols, and real-time analytics, enabling edge computing and reducing reliance on cloud services.3. Image and video processing: With its high-performance processing capabilities, the chip is well-suited for image and video processing applications. It can perform tasks such as image recognition, object tracking, and video streaming, making it useful in surveillance systems, automotive vision systems, and multimedia applications.4. Communications: The XC7Z007S-1CLG225I chip can be used in communications applications that require signal processing, protocol implementation, and data transmission. It can be used in software-defined radios, wireless base stations, and networking equipment.Overall, the XC7Z007S-1CLG225I chip offers a versatile solution for various applications, combining processing power with programmable logic integration and power efficiency.
MAX392CSE+ Relevant information