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DG271BCJ-E3

DG271BCJ-E3

Manufacturer No:

DG271BCJ-E3

Manufacturer:

Vishay Siliconix

Description:

IC SWITCH SPST-NCX4 50OHM 16DIP

Datasheet:

Datasheet

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DG271BCJ-E3 Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-PDIP
  • Package / Case
    16-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -100dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    1nA
  • Channel Capacitance (CS(off), CD(off))
    8pF, 8pF
  • Charge Injection
    -5pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    65ns, 65ns
  • Voltage - Supply, Dual (V±)
    ±15V
  • Voltage - Supply, Single (V+)
    -
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    50Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NC
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The P1010NXN5HHB is a specific model of integrated circuit (IC) chip manufactured by NXP Semiconductors. It belongs to the PowerQUICC II Pro family of processors. Here are some advantages and application scenarios of the P1010NXN5HHB IC chips:Advantages: 1. High Performance: The P1010NXN5HHB chip offers a high-performance 32-bit Power Architecture core, capable of running at speeds up to 800 MHz. It provides efficient processing power for various applications. 2. Low Power Consumption: The chip is designed to be power-efficient, making it suitable for applications where power consumption is a concern. 3. Integrated Peripherals: It includes various integrated peripherals such as Ethernet controllers, USB ports, UARTs, I2C, SPI, and more. These peripherals enhance the chip's versatility and reduce the need for additional external components. 4. Scalability: The P1010NXN5HHB chip is highly scalable, allowing for easy integration into different system designs and applications. 5. Industrial-Grade Reliability: It is designed to meet industrial-grade requirements, ensuring reliability and robustness in harsh environments.Application Scenarios: 1. Networking Equipment: The P1010NXN5HHB chip is commonly used in networking equipment such as routers, switches, gateways, and access points. Its high-performance processing capabilities and integrated peripherals make it suitable for these applications. 2. Industrial Automation: The chip's industrial-grade reliability and low power consumption make it suitable for various industrial automation applications. It can be used in programmable logic controllers (PLCs), human-machine interfaces (HMIs), and other automation systems. 3. Embedded Systems: The P1010NXN5HHB chip is often used in embedded systems where a balance between performance and power efficiency is required. It can be utilized in applications like digital signage, automotive infotainment systems, and smart appliances. 4. Communication Systems: Due to its integrated Ethernet controllers and other communication peripherals, the chip finds applications in communication systems such as base stations, small cells, and wireless access points. 5. Internet of Things (IoT): The P1010NXN5HHB chip's low power consumption and scalability make it suitable for IoT applications. It can be used in IoT gateways, edge computing devices, and other IoT infrastructure.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and system design of each application.
DG271BCJ-E3 Relevant information