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DG403DYZ

DG403DYZ

Manufacturer No:

DG403DYZ

Description:

IC SWITCH SPDT X 2 45OHM 16SOIC

Datasheet:

Datasheet

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DG403DYZ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -90dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    500pA
  • Channel Capacitance (CS(off), CD(off))
    12pF, 12pF
  • Charge Injection
    60pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    150ns, 100ns
  • Voltage - Supply, Dual (V±)
    ±5V ~ 17V
  • Voltage - Supply, Single (V+)
    5V ~ 34V
  • Channel-to-Channel Matching (ΔRon)
    3Ohm
  • On-State Resistance (Max)
    45Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    SPDT
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The M2S060T-1FGG676I is an integrated circuit chip from Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S060T-1FGG676I chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 processor core. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, processor, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features like secure boot, tamper detection, and secure key storage. This makes the M2S060T-1FGG676I chip suitable for applications that require robust security measures. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 processor provide high-performance computing capabilities, enabling complex algorithms and real-time processing.Application scenarios: 1. Industrial automation: The M2S060T-1FGG676I chip can be used in industrial automation systems for tasks like motor control, sensor interfacing, and communication protocols. The FPGA fabric allows for customization and adaptation to specific industrial requirements. 2. Internet of Things (IoT): With its low power consumption and integration of FPGA and processor, the chip can be used in IoT devices for edge computing, data processing, and connectivity. 3. Aerospace and defense: The security features of the SmartFusion2 family make the M2S060T-1FGG676I chip suitable for aerospace and defense applications that require secure communication, encryption, and protection against tampering. 4. Medical devices: The chip can be used in medical devices for tasks like signal processing, data acquisition, and control systems. The FPGA fabric allows for real-time customization and adaptation to changing medical requirements. 5. Communications: The M2S060T-1FGG676I chip can be used in communication systems for tasks like protocol conversion, encryption, and signal processing. The integration of FPGA and processor allows for flexibility and adaptability to different communication standards.These are just a few examples of the advantages and application scenarios of the M2S060T-1FGG676I chip. The versatility and integration of this chip make it suitable for a wide range of applications where customization, performance, and security are important.
DG403DYZ Relevant information