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MC14051BDG

MC14051BDG

Manufacturer No:

MC14051BDG

Manufacturer:

onsemi

Description:

IC MUX 8:1 280OHM 16SOIC

Datasheet:

Datasheet

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MC14051BDG Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -55°C ~ 125°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    100nA
  • Channel Capacitance (CS(off), CD(off))
    7.5pF
  • Charge Injection
    -
  • -3db Bandwidth
    17MHz
  • Switch Time (Ton, Toff) (Max)
    -
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    3V ~ 18V
  • Channel-to-Channel Matching (ΔRon)
    10Ohm
  • On-State Resistance (Max)
    280Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The XCZU1CG-L1SBVA484I is a specific model of the Xilinx Zynq UltraScale+ MPSoC family of integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The XCZU1CG-L1SBVA484I chip combines a high-performance processing system (Quad-core ARM Cortex-A53) with programmable logic (FPGA) in a single device. This allows for a wide range of applications that require both processing power and hardware acceleration.2. High-performance processing: The ARM Cortex-A53 cores provide efficient and powerful processing capabilities, making it suitable for applications that require real-time processing, high-speed data processing, and complex algorithms.3. Programmable logic: The integrated FPGA fabric allows for hardware customization and acceleration. It can be programmed to implement custom logic, interfaces, and algorithms, enabling high-performance and low-latency processing for specific tasks.4. Low power consumption: The XCZU1CG-L1SBVA484I chip is designed to be power-efficient, making it suitable for applications where power consumption is a concern.Application scenarios: 1. Embedded systems: The XCZU1CG-L1SBVA484I chip is commonly used in embedded systems that require a combination of processing power and hardware acceleration. It can be used in applications such as industrial automation, robotics, automotive systems, and aerospace.2. High-performance computing: The chip's processing capabilities and FPGA fabric make it suitable for high-performance computing applications. It can be used in areas like data centers, scientific research, and financial analysis, where parallel processing and acceleration are crucial.3. Video and image processing: The XCZU1CG-L1SBVA484I chip's FPGA fabric can be utilized for real-time video and image processing tasks. It can be used in applications like video surveillance, medical imaging, and computer vision.4. Wireless communication: The chip's processing power and FPGA fabric can be leveraged for wireless communication systems. It can be used in applications such as software-defined radios, wireless base stations, and network infrastructure.5. Internet of Things (IoT): The XCZU1CG-L1SBVA484I chip's combination of processing power and programmable logic makes it suitable for IoT applications. It can be used in edge computing devices, IoT gateways, and smart devices that require real-time processing and customization.It's important to note that the specific application scenarios may vary depending on the requirements and customization of the chip for a particular use case.
MC14051BDG Relevant information