DG419DY-E3

DG419DY-E3

Manufacturer No:

DG419DY-E3

Manufacturer:

Vishay Siliconix

Description:

IC SWITCH SPDT X 1 35OHM 8SOIC

Datasheet:

Datasheet

Delivery:

Payment:

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DG419DY-E3 Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    250pA
  • Channel Capacitance (CS(off), CD(off))
    8pF, 8pF
  • Charge Injection
    60pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    175ns, 145ns
  • Voltage - Supply, Dual (V±)
    ±15V
  • Voltage - Supply, Single (V+)
    12V
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    35Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    SPDT
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The M2S060-FCS325 is an integrated circuit chip developed by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S060-FCS325 chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family of chips, including the M2S060-FCS325, provides built-in security features such as secure boot, tamper detection, and secure key storage. These features help protect the system against unauthorized access and ensure the integrity of the firmware. 4. Low power consumption: The M2S060-FCS325 chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications.Application scenarios: 1. Industrial automation: The M2S060-FCS325 chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. The FPGA fabric allows for customization of the hardware interfaces, while the microcontroller subsystem can handle real-time control and communication tasks. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller, the chip is well-suited for IoT applications. It can be used to implement IoT gateways, edge computing devices, or sensor nodes. The FPGA fabric can handle data preprocessing or protocol conversion, while the microcontroller subsystem can handle communication and control tasks. 3. Aerospace and defense: The M2S060-FCS325 chip's security features make it suitable for aerospace and defense applications. It can be used in avionics systems, secure communication devices, or military-grade embedded systems where data integrity and security are critical. 4. Medical devices: The chip's low power consumption and integration make it suitable for medical devices such as patient monitoring systems, portable diagnostic devices, or implantable devices. The FPGA fabric can be used for signal processing or customization of interfaces, while the microcontroller subsystem can handle data acquisition and communication.These are just a few examples of the advantages and application scenarios of the M2S060-FCS325 chip. The versatility and integration of this chip make it suitable for a wide range of applications where both hardware customization and software programmability are required.