ISL54059IRTZ

ISL54059IRTZ

Manufacturer No:

ISL54059IRTZ

Description:

IC SWITCH SPDTX2 520MOHM 10TDFN

Datasheet:

Datasheet

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ISL54059IRTZ Specifications

  • Type
    Parameter
  • Supplier Device Package
    10-TDFN (3x3)
  • Package / Case
    10-VFDFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -75dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    8.13nA
  • Channel Capacitance (CS(off), CD(off))
    36pF
  • Charge Injection
    170pC
  • -3db Bandwidth
    60MHz
  • Switch Time (Ton, Toff) (Max)
    35ns, 16ns
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    1.8V ~ 6.5V
  • Channel-to-Channel Matching (ΔRon)
    10mOhm
  • On-State Resistance (Max)
    520mOhm (Typ)
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    SPDT
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The XCZU2CG-L1SFVA625I is an integrated circuit chip from Xilinx, which belongs to the Zynq UltraScale+ MPSoC family. It offers several advantages and can be applied in various scenarios. Here are some of its key advantages and application scenarios:Advantages: 1. High-performance processing: The XCZU2CG-L1SFVA625I chip combines a quad-core ARM Cortex-A53 processor with a dual-core ARM Cortex-R5 real-time processor, along with programmable logic resources. This allows for high-performance processing capabilities, making it suitable for demanding applications.2. Programmable logic resources: The chip includes programmable logic resources, which can be customized and reconfigured to implement specific functionalities. This flexibility enables the chip to adapt to different application requirements and allows for hardware acceleration of specific algorithms.3. Integrated peripherals: The XCZU2CG-L1SFVA625I chip integrates various peripherals, such as USB, Ethernet, PCIe, and DDR memory controllers. This integration simplifies system design and reduces the need for additional external components.4. Low power consumption: The chip is designed to optimize power consumption, making it suitable for power-constrained applications. It includes power management features that allow for dynamic power scaling and efficient power utilization.Application scenarios: 1. Embedded systems: The XCZU2CG-L1SFVA625I chip is well-suited for embedded systems that require a combination of high-performance processing and programmable logic capabilities. It can be used in applications such as industrial automation, robotics, and automotive systems.2. Edge computing: With its powerful processing capabilities and programmable logic resources, the chip can be used in edge computing scenarios. It enables real-time data processing and analysis at the edge of the network, reducing latency and improving overall system performance.3. High-bandwidth applications: The XCZU2CG-L1SFVA625I chip supports high-speed interfaces like PCIe and Ethernet, making it suitable for applications that require high-bandwidth data transfer. This includes applications in areas like data centers, networking, and high-performance computing.4. Software-defined systems: The chip's programmable logic resources allow for the implementation of software-defined functionalities, enabling the chip to adapt to changing requirements and support dynamic reconfiguration. This makes it suitable for software-defined networking, software-defined radio, and other similar applications.Overall, the XCZU2CG-L1SFVA625I chip offers a combination of high-performance processing, programmable logic capabilities, and integrated peripherals, making it versatile for a wide range of applications in various industries.