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ADG819BRTZ-REEL

ADG819BRTZ-REEL

Manufacturer No:

ADG819BRTZ-REEL

Manufacturer:

Analog Devices Inc.

Description:

IC SWITCH SPDTX1 600MOHM SOT23-6

Datasheet:

Datasheet

Delivery:

Payment:

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ADG819BRTZ-REEL Specifications

  • Type
    Parameter
  • Supplier Device Package
    SOT-23-6
  • Package / Case
    SOT-23-6
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Crosstalk
    -72dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    250pA
  • Channel Capacitance (CS(off), CD(off))
    80pF
  • Charge Injection
    20pC
  • -3db Bandwidth
    17MHz
  • Switch Time (Ton, Toff) (Max)
    45ns, 16ns
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    1.8V ~ 5.5V
  • Channel-to-Channel Matching (ΔRon)
    60mOhm
  • On-State Resistance (Max)
    600mOhm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    SPDT
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The M2S050-FCSG325I is an integrated circuit chip developed by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S050-FCSG325I chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family of chips, including the M2S050-FCSG325I, offers advanced security features such as secure boot, tamper detection, and secure key storage. These features make it suitable for applications that require high levels of security, such as industrial control systems, defense, and aerospace. 4. Low power consumption: The M2S050-FCSG325I chip is designed to operate with low power consumption. It incorporates power management features that allow for efficient power usage, making it suitable for battery-powered or energy-efficient applications.Application scenarios: 1. Industrial automation: The M2S050-FCSG325I chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. Its FPGA fabric allows for customization and adaptation to specific industrial requirements. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller subsystem, the chip can be used in IoT applications for edge computing, data processing, and connectivity. Its security features also make it suitable for securing IoT devices and networks. 3. Medical devices: The M2S050-FCSG325I chip can be utilized in medical devices such as patient monitoring systems, diagnostic equipment, and medical imaging devices. Its versatility allows for customization and adaptation to specific medical requirements. 4. Aerospace and defense: The chip's security features, low power consumption, and integration make it suitable for aerospace and defense applications. It can be used in avionics systems, unmanned aerial vehicles (UAVs), secure communication systems, and more.These are just a few examples of the advantages and application scenarios of the M2S050-FCSG325I chip. Its versatility, integration, security features, and low power consumption make it a suitable choice for a wide range of applications in various industries.
ADG819BRTZ-REEL Relevant information