DG2535EDQ-T1-GE3

DG2535EDQ-T1-GE3

Manufacturer No:

DG2535EDQ-T1-GE3

Manufacturer:

Vishay Siliconix

Description:

IC SWITCH SPDTX2 500MOHM 10MSOP

Datasheet:

Datasheet

Delivery:

Payment:

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DG2535EDQ-T1-GE3 Specifications

  • Type
    Parameter
  • Supplier Device Package
    10-MSOP
  • Package / Case
    10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -90dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    -
  • Channel Capacitance (CS(off), CD(off))
    -
  • Charge Injection
    -
  • -3db Bandwidth
    120MHz
  • Switch Time (Ton, Toff) (Max)
    78ns, 58ns
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    1.65V ~ 5.5V
  • Channel-to-Channel Matching (ΔRon)
    60mOhm
  • On-State Resistance (Max)
    500mOhm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    SPDT
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The 5CSEMA6F31C8N is an integrated circuit chip from Intel's Cyclone V series of Field-Programmable Gate Arrays (FPGAs). Here are some advantages and application scenarios of this chip:Advantages: 1. High Performance: The 5CSEMA6F31C8N chip offers high-speed processing capabilities, making it suitable for applications that require real-time data processing and high-performance computing. 2. Flexibility: Being an FPGA, it allows for reprogramming and customization of the chip's functionality even after deployment. This flexibility makes it suitable for applications that require frequent updates or changes in functionality. 3. Low Power Consumption: The chip is designed to be power-efficient, making it suitable for battery-powered or energy-constrained applications. 4. Integration: The 5CSEMA6F31C8N chip integrates various components like logic elements, memory blocks, and digital signal processing (DSP) blocks, reducing the need for external components and simplifying the overall system design.Application Scenarios: 1. Embedded Systems: The chip can be used in various embedded systems applications, such as industrial automation, robotics, and automotive electronics. Its high performance and flexibility make it suitable for controlling and processing data in real-time. 2. Communications: The 5CSEMA6F31C8N chip can be used in communication systems, including wireless base stations, routers, and network switches. Its high-speed processing capabilities and integration of DSP blocks make it suitable for handling data packets and signal processing tasks. 3. Video and Image Processing: The chip's high-performance computing capabilities and integration of DSP blocks make it suitable for video and image processing applications, such as video surveillance, medical imaging, and multimedia systems. 4. Internet of Things (IoT): The chip can be used in IoT devices that require real-time data processing and low power consumption. Its flexibility allows for customization and adaptation to different IoT applications, such as smart home automation, environmental monitoring, and wearable devices.These are just a few examples of the advantages and application scenarios of the 5CSEMA6F31C8N integrated circuit chip. The specific use cases may vary depending on the requirements and needs of the application.