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74HCT4066DB118

74HCT4066DB118

Manufacturer No:

74HCT4066DB118

Manufacturer:

NXP USA Inc.

Description:

NOW NEXPERIA 74HCT4066DB - SPST,

Datasheet:

Datasheet

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74HCT4066DB118 Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Package / Case
    -
  • Mounting Type
    -
  • Operating Temperature
    -
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    -
  • Channel Capacitance (CS(off), CD(off))
    -
  • Charge Injection
    -
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    -
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    -
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    -
  • Multiplexer/Demultiplexer Circuit
    -
  • Switch Circuit
    -
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    *
The XCZU47DR-2FFVG1517I is a specific model of integrated circuit (IC) chip from Xilinx. It belongs to the Xilinx Zynq UltraScale+ MPSoC family and offers several advantages and application scenarios. Here are some key points:Advantages: 1. High-performance processing: The XCZU47DR-2FFVG1517I chip combines a quad-core ARM Cortex-A53 processor with a dual-core ARM Cortex-R5 real-time processor, along with programmable logic resources. This allows for high-performance processing capabilities suitable for a wide range of applications. 2. Programmable logic resources: The chip includes programmable logic resources, which can be customized and reconfigured to implement specific functionalities as per the application requirements. This flexibility makes it suitable for various applications. 3. Integrated peripherals: The XCZU47DR-2FFVG1517I chip integrates various peripherals like USB, Ethernet, PCIe, and memory controllers, which simplifies system design and reduces the need for additional external components. 4. High-speed interfaces: The chip supports high-speed interfaces like DDR4 memory, DisplayPort, HDMI, and Gigabit Ethernet, enabling connectivity with external devices and systems. 5. Low power consumption: The XCZU47DR-2FFVG1517I chip is designed to optimize power consumption, making it suitable for power-constrained applications.Application Scenarios: 1. Embedded systems: The XCZU47DR-2FFVG1517I chip is commonly used in embedded systems that require high-performance processing capabilities along with programmable logic resources. It can be used in applications like industrial automation, robotics, and automotive systems. 2. Edge computing: With its combination of processing power and programmable logic, the chip is suitable for edge computing applications. It can perform real-time processing and analytics at the edge of the network, enabling faster response times and reduced data transfer. 3. Video processing and analytics: The high-speed interfaces and processing capabilities of the chip make it suitable for video processing and analytics applications. It can be used in video surveillance systems, video transcoding, and augmented reality/virtual reality (AR/VR) applications. 4. High-performance computing: The XCZU47DR-2FFVG1517I chip can be used in high-performance computing applications that require parallel processing capabilities. It can accelerate computationally intensive tasks and algorithms, such as scientific simulations and data analytics.These are just a few examples of the advantages and application scenarios of the XCZU47DR-2FFVG1517I chip. The specific usage depends on the requirements and design considerations of the target application.
74HCT4066DB118 Relevant information