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MAX313LCPE+

MAX313LCPE+

Manufacturer No:

MAX313LCPE+

Description:

IC SWITCH SPST-NOX4 10OHM 16DIP

Datasheet:

Datasheet

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MAX313LCPE+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-PDIP
  • Package / Case
    16-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Crosstalk
    -85dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    500pA
  • Channel Capacitance (CS(off), CD(off))
    15pF, 15pF
  • Charge Injection
    20pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    225ns, 185ns
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 20V
  • Voltage - Supply, Single (V+)
    4.5V ~ 36V
  • Channel-to-Channel Matching (ΔRon)
    300mOhm
  • On-State Resistance (Max)
    10Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The M2S050-FCS325I is an integrated circuit chip developed by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S050-FCS325I chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family of chips, including the M2S050-FCS325I, offers advanced security features such as secure boot, tamper detection, and secure key storage. These features make it suitable for applications that require high levels of security. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications.Application scenarios: 1. Industrial automation: The M2S050-FCS325I chip can be used in industrial automation applications such as motor control, robotics, and process control. Its FPGA fabric allows for real-time customization and adaptation to specific industrial requirements. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller subsystem, the chip is well-suited for IoT applications. It can be used in smart home devices, sensor networks, and edge computing applications where both hardware flexibility and software programmability are required. 3. Aerospace and defense: The advanced security features of the chip make it suitable for aerospace and defense applications. It can be used in secure communication systems, avionics, and military-grade embedded systems. 4. Medical devices: The chip's low power consumption and integration capabilities make it suitable for medical devices such as patient monitoring systems, portable medical devices, and medical imaging equipment. 5. Automotive: The M2S050-FCS325I chip can be used in automotive applications such as advanced driver-assistance systems (ADAS), infotainment systems, and vehicle control units. Its FPGA fabric allows for customization and adaptation to specific automotive requirements.These are just a few examples of the advantages and application scenarios of the M2S050-FCS325I chip. The versatility and integration capabilities of this chip make it suitable for a wide range of applications across various industries.
MAX313LCPE+ Relevant information