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TS5MP645NYFPR

TS5MP645NYFPR

Manufacturer No:

TS5MP645NYFPR

Manufacturer:

Texas Instruments

Description:

IC SWITCH SPDTX10 6.5OHM 36DSBGA

Datasheet:

Datasheet

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TS5MP645NYFPR Specifications

  • Type
    Parameter
  • Supplier Device Package
    36-DSBGA
  • Package / Case
    36-XFBGA, DSBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Crosstalk
    -40dB @ 1.25GHz
  • Current - Leakage (IS(off)) (Max)
    500nA
  • Channel Capacitance (CS(off), CD(off))
    1.5pF
  • Charge Injection
    -
  • -3db Bandwidth
    1.5GHz
  • Switch Time (Ton, Toff) (Max)
    -
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    1.65V ~ 5.5V
  • Channel-to-Channel Matching (ΔRon)
    100mOhm
  • On-State Resistance (Max)
    6.5Ohm
  • Number of Circuits
    10
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    SPDT
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Not For New Designs
  • Series
    -
The MPC850DEZQ50BUR2 is a specific model of the MPC850 PowerQUICC microprocessor family developed by Freescale Semiconductor (now NXP Semiconductors). This integrated circuit chip offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the MPC850DEZQ50BUR2 are:Advantages: 1. High Performance: The MPC850DEZQ50BUR2 chip is designed to deliver high performance with a clock speed of 50 MHz. It offers a powerful processing capability for various applications.2. PowerQUICC Architecture: The PowerQUICC architecture combines a PowerPC core with communication peripherals, making it suitable for networking and communication applications.3. Integrated Communication Peripherals: The chip includes integrated communication peripherals such as Ethernet, UART, and I2C, which enable seamless connectivity and communication in networking applications.4. Real-Time Operating System (RTOS) Support: The MPC850DEZQ50BUR2 chip is compatible with various real-time operating systems, allowing developers to build real-time applications with deterministic behavior.5. Low Power Consumption: The chip is designed to operate with low power consumption, making it suitable for applications where power efficiency is crucial.Application Scenarios: 1. Networking Equipment: The MPC850DEZQ50BUR2 chip can be used in networking equipment such as routers, switches, and gateways. Its high performance and integrated communication peripherals make it suitable for handling network traffic and managing network protocols.2. Industrial Automation: The chip can be applied in industrial automation systems, where it can control and monitor various processes. Its real-time capabilities and low power consumption make it suitable for applications that require precise control and long-term operation.3. Embedded Systems: The MPC850DEZQ50BUR2 chip can be used in embedded systems for various applications, including automotive, aerospace, and consumer electronics. Its high performance and integrated communication peripherals enable seamless connectivity and efficient processing in these systems.4. Communication Infrastructure: The chip can be utilized in communication infrastructure equipment such as base stations and access points. Its high performance and integrated communication peripherals make it suitable for handling wireless protocols and managing network connectivity.Overall, the MPC850DEZQ50BUR2 integrated circuit chip offers high performance, integrated communication peripherals, and low power consumption, making it suitable for a range of applications in networking, industrial automation, embedded systems, and communication infrastructure.
TS5MP645NYFPR Relevant information