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NLAS4684MR2G

NLAS4684MR2G

Manufacturer No:

NLAS4684MR2G

Manufacturer:

onsemi

Description:

IC SWITCH SPDTX2 800MOHM 10MICRO

Datasheet:

Datasheet

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NLAS4684MR2G Specifications

  • Type
    Parameter
  • Supplier Device Package
    10-Micro
  • Package / Case
    10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -55°C ~ 125°C (TA)
  • Crosstalk
    -83dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    1µA
  • Channel Capacitance (CS(off), CD(off))
    102pF, 104pF
  • Charge Injection
    15pC
  • -3db Bandwidth
    9.5MHz
  • Switch Time (Ton, Toff) (Max)
    30ns, 30ns
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    1.8V ~ 5.5V
  • Channel-to-Channel Matching (ΔRon)
    60mOhm
  • On-State Resistance (Max)
    800mOhm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    SPDT
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Last Time Buy
  • Series
    -
The XCZU1CG-1SFVC784E is a specific model of the Xilinx Zynq UltraScale+ MPSoC (Multiprocessor System-on-Chip) family. It is a highly integrated circuit chip that combines programmable logic (FPGA) and processing system (ARM Cortex-A53) on a single chip. Here are some advantages and application scenarios of this chip:Advantages: 1. High performance: The XCZU1CG-1SFVC784E chip offers high-performance processing capabilities with its ARM Cortex-A53 processor cores and programmable logic resources. It can handle complex tasks and applications efficiently. 2. Flexibility: Being a programmable logic chip, it allows for customization and flexibility in implementing various functions and algorithms. The programmable logic fabric can be used to accelerate specific tasks or implement custom hardware accelerators. 3. Integration: The chip integrates both processing system and programmable logic, reducing the need for multiple chips and simplifying the overall system design. This integration also enables efficient communication and data transfer between the processing system and programmable logic. 4. Power efficiency: The XCZU1CG-1SFVC784E chip is designed to be power-efficient, making it suitable for applications where power consumption is a concern. 5. Scalability: The Zynq UltraScale+ MPSoC family offers different models with varying capabilities, allowing for scalability based on the application requirements.Application scenarios: 1. Embedded systems: The XCZU1CG-1SFVC784E chip is commonly used in embedded systems where both processing power and programmable logic capabilities are required. It can be used in applications such as industrial automation, robotics, automotive systems, and aerospace. 2. High-performance computing: The chip's FPGA fabric can be utilized to accelerate computationally intensive tasks, making it suitable for applications like data centers, machine learning, and scientific computing. 3. Software-defined networking: The XCZU1CG-1SFVC784E chip can be used in networking equipment to implement software-defined networking (SDN) functionalities, such as packet processing, traffic management, and security. 4. Video and image processing: The chip's high-performance processing system combined with programmable logic can be used for real-time video and image processing applications, including video analytics, surveillance systems, and medical imaging. 5. Wireless communication: The XCZU1CG-1SFVC784E chip can be used in wireless communication systems, such as base stations and software-defined radios, to handle signal processing tasks and implement custom communication protocols.These are just a few examples of the advantages and application scenarios of the XCZU1CG-1SFVC784E chip. The versatility and flexibility of the chip make it suitable for a wide range of applications that require both processing power and programmable logic capabilities.
NLAS4684MR2G Relevant information