HEF4052BTT,118
Manufacturer No:
HEF4052BTT,118
Manufacturer:
Description:
IC SWITCH SP4TX2 155OHM 16TSSOP
Datasheet:
Delivery:
Payment:
In Stock : 250
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HEF4052BTT,118 Specifications
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TypeParameter
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Supplier Device Package16-TSSOP
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Package / Case16-TSSOP (0.173", 4.40mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 125°C (TA)
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Crosstalk-50dB @ 1MHz
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Current - Leakage (IS(off)) (Max)200nA
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Channel Capacitance (CS(off), CD(off))7.5pF
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Charge Injection-
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-3db Bandwidth70MHz
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Switch Time (Ton, Toff) (Max)-
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Voltage - Supply, Dual (V±)-
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Voltage - Supply, Single (V+)3V ~ 15V
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Channel-to-Channel Matching (ΔRon)5Ohm
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On-State Resistance (Max)155Ohm
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Number of Circuits2
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Multiplexer/Demultiplexer Circuit4:1
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Switch CircuitSP4T
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PackagingCut Tape (CT)
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PackagingTape & Reel (TR)
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Product StatusActive
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Series-
The XCZU3CG-1UBVA530I is a specific model of the Xilinx Zynq UltraScale+ MPSoC family of integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The XCZU3CG-1UBVA530I combines a high-performance processing system (Quad-core ARM Cortex-A53) with programmable logic (FPGA) in a single chip. This allows for a wide range of applications and flexibility in system design. 2. High-performance processing: The ARM Cortex-A53 cores provide powerful processing capabilities, enabling complex tasks such as real-time processing, image and video processing, and machine learning. 3. Programmable logic: The FPGA fabric in the chip allows for hardware acceleration, custom logic implementation, and real-time processing of data. It can be reprogrammed to adapt to changing requirements or to optimize performance. 4. Integrated peripherals: The chip includes various peripherals such as USB, Ethernet, PCIe, and memory interfaces, reducing the need for additional external components and simplifying system design. 5. Low power consumption: The XCZU3CG-1UBVA530I is designed to be power-efficient, making it suitable for applications with strict power constraints.Application scenarios: 1. Embedded systems: The XCZU3CG-1UBVA530I is commonly used in embedded systems where both high-performance processing and programmable logic are required. It can be used in applications such as industrial automation, robotics, and automotive systems. 2. Edge computing: With its processing power and FPGA fabric, the chip is suitable for edge computing applications where real-time processing and low latency are crucial. It can be used in edge AI, video analytics, and IoT gateways. 3. High-performance computing: The XCZU3CG-1UBVA530I can be used in applications that require high-performance computing, such as scientific research, data centers, and signal processing. 4. Software-defined networking: The chip's programmable logic can be utilized for implementing custom networking protocols, accelerating packet processing, and optimizing network performance. 5. Aerospace and defense: The XCZU3CG-1UBVA530I is suitable for aerospace and defense applications that require high reliability, real-time processing, and flexibility. It can be used in radar systems, avionics, and communication systems.These are just a few examples, and the XCZU3CG-1UBVA530I can be applied in various other domains depending on the specific requirements of the system.
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