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DG405EY

DG405EY

Manufacturer No:

DG405EY

Manufacturer:

Harris Corporation

Description:

IC SW DPST-NO/NCX2 45OHM 16SOIC

Datasheet:

Datasheet

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DG405EY Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    500pA
  • Channel Capacitance (CS(off), CD(off))
    12pF, 12pF
  • Charge Injection
    60pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    150ns, 100ns
  • Voltage - Supply, Dual (V±)
    ±5V ~ 17V
  • Voltage - Supply, Single (V+)
    5V ~ 34V
  • Channel-to-Channel Matching (ΔRon)
    3Ohm
  • On-State Resistance (Max)
    45Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    DPST - NO/NC
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The XCZU1CG-L1SFVA625I is an integrated circuit chip from Xilinx, specifically from their Zynq UltraScale+ MPSoC family. This chip offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the XCZU1CG-L1SFVA625I chip are:Advantages: 1. High-performance processing: The chip combines a processing system (Quad-core ARM Cortex-A53) with programmable logic (FPGA) to provide high-performance processing capabilities. 2. Versatility: The programmable logic (FPGA) allows for customization and flexibility, enabling the chip to be used in a wide range of applications. 3. Integration: The chip integrates multiple components, including processors, memory, and peripherals, reducing the need for external components and simplifying system design. 4. Power efficiency: The chip is designed to be power-efficient, making it suitable for applications with strict power constraints. 5. Scalability: The chip is part of the Zynq UltraScale+ MPSoC family, which offers different variants with varying levels of performance and features. This allows for scalability and the ability to choose the right chip for specific application requirements.Application Scenarios: 1. Embedded Systems: The XCZU1CG-L1SFVA625I chip is well-suited for embedded systems that require high-performance processing and customization. It can be used in applications such as industrial automation, robotics, and automotive systems. 2. Edge Computing: With its processing capabilities and programmable logic, the chip can be used in edge computing scenarios where real-time processing and low latency are crucial. It can enable tasks like AI inference, video analytics, and sensor data processing at the edge of the network. 3. Communications: The chip's integration of processors and programmable logic makes it suitable for communication applications. It can be used in wireless base stations, network switches, and routers to handle data processing, protocol offloading, and customization. 4. Medical Devices: The chip's high-performance processing and customization capabilities make it applicable in medical devices such as imaging systems, patient monitoring devices, and diagnostic equipment. 5. Aerospace and Defense: The chip's power efficiency, processing power, and customization options make it suitable for aerospace and defense applications. It can be used in radar systems, avionics, communication systems, and unmanned vehicles.These are just a few examples of the advantages and application scenarios of the XCZU1CG-L1SFVA625I chip. The versatility and performance of the chip make it applicable in various industries and use cases where high-performance processing, customization, and integration are required.
DG405EY Relevant information