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CD74HC4353E

CD74HC4353E

Manufacturer No:

CD74HC4353E

Manufacturer:

Harris Corporation

Description:

IC SWITCH SPST-NOX2 130OHM 20DIP

Datasheet:

Datasheet

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CD74HC4353E Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-PDIP
  • Package / Case
    20-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    -55°C ~ 125°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    100nA
  • Channel Capacitance (CS(off), CD(off))
    5pF
  • Charge Injection
    -
  • -3db Bandwidth
    200MHz
  • Switch Time (Ton, Toff) (Max)
    21ns, 23ns
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    4.5V ~ 5.5V
  • Channel-to-Channel Matching (ΔRon)
    5Ohm
  • On-State Resistance (Max)
    130Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The MPC860ENZQ66D4557 is a specific model of the MPC860 PowerQUICC integrated circuit chip, which is designed for embedded systems and networking applications. Here are some advantages and application scenarios of the MPC860ENZQ66D4557:Advantages: 1. High Performance: The MPC860ENZQ66D4557 chip offers a high-performance PowerPC architecture with a clock speed of up to 66 MHz, enabling efficient processing of complex tasks. 2. Integrated Features: It integrates various peripherals like Ethernet, UART, timers, DMA controllers, and general-purpose I/O ports, reducing the need for additional external components. 3. Networking Capabilities: The chip supports various networking protocols like Ethernet, Fast Ethernet, and Token Ring, making it suitable for networking applications. 4. Low Power Consumption: The MPC860ENZQ66D4557 chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient devices. 5. Industrial Temperature Range: It can operate reliably in a wide temperature range, typically from -40°C to +85°C, making it suitable for industrial applications.Application Scenarios: 1. Embedded Systems: The MPC860ENZQ66D4557 chip is commonly used in embedded systems like industrial automation, robotics, and control systems, where high-performance processing and networking capabilities are required. 2. Networking Equipment: It can be used in networking equipment such as routers, switches, gateways, and network interface cards (NICs) to provide networking functionality. 3. Communication Systems: The chip can be utilized in communication systems like telecommunication switches, base stations, and wireless access points to handle data processing and networking tasks. 4. Automotive Electronics: It can be employed in automotive applications like engine control units (ECUs), infotainment systems, and telematics devices, where real-time processing and networking capabilities are essential. 5. Internet of Things (IoT): The chip can be used in IoT devices that require connectivity and processing capabilities, such as smart home devices, industrial IoT sensors, and wearable devices.These are just a few examples of the advantages and application scenarios of the MPC860ENZQ66D4557 integrated circuit chip. The specific usage may vary depending on the requirements of the system or product being developed.
CD74HC4353E Relevant information